There are no models available for this part yet.
Overview of M30262F8GP-D9 by Renesas Electronics Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Smart Cities
CAD Models for M30262F8GP-D9 by Renesas Electronics Corporation
Part Data Attributes for M30262F8GP-D9 by Renesas Electronics Corporation
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|---|---|
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Rohs Code
|
No
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Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
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RENESAS ELECTRONICS CORP
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Part Package Code
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QFP
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Pin Count
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48
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Reach Compliance Code
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unknown
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HTS Code
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8542.31.00.01
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Bit Size
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16
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CPU Family
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M16C
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JESD-30 Code
|
S-PQFP-G48
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Number of Terminals
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48
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-20 °C
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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QFP
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Package Equivalence Code
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QFP48,.35SQ,20
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Package Shape
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SQUARE
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Package Style
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FLATPACK
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Qualification Status
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Not Qualified
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RAM (bytes)
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2048
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ROM (words)
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65536
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ROM Programmability
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FLASH
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Speed
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20 MHz
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Supply Current-Max
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19 mA
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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OTHER
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Terminal Form
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GULL WING
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Terminal Pitch
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0.5 mm
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Terminal Position
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QUAD
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