|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
MICROSEMI CORP
|
|
Package Description
|
FBGA,
|
|
Reach Compliance Code
|
not_compliant
|
|
HTS Code
|
8542.39.00.01
|
|
Samacsys Manufacturer
|
Microsemi Corporation
|
|
Additional Feature
|
LG-MIN, WD-MIN
|
|
JESD-30 Code
|
S-PBGA-B484
|
|
JESD-609 Code
|
e0
|
|
Length
|
19 mm
|
|
Number of Terminals
|
484
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
FBGA
|
|
Package Equivalence Code
|
BGA484,22X22,32
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
240
|
|
Programmable Logic Type
|
FIELD PROGRAMMABLE GATE ARRAY
|
|
Seated Height-Max
|
3.15 mm
|
|
Supply Voltage-Max
|
1.26 V
|
|
Supply Voltage-Min
|
1.14 V
|
|
Supply Voltage-Nom
|
1.2 V
|
|
Surface Mount
|
YES
|
|
Terminal Finish
|
Tin/Lead (Sn/Pb)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
19 mm
|
