Part Details for M2S090T-FG676 by Microchip Technology Inc
Overview of M2S090T-FG676 by Microchip Technology Inc
- Distributor Offerings: (8 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for M2S090T-FG676
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ8550
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Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 86Kles 676 Pbga 27X27X2.44Mm Tray Rohs Compliant: Yes |Microchip M2S090T-FG676 RoHS: Compliant Min Qty: 40 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$258.5100 / $277.5200 | Buy Now |
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DISTI #
M2S090T-FG676-ND
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DigiKey | IC SOC CORTEX-M3 166MHZ 676FBGA Min Qty: 40 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$277.5202 | Buy Now |
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DISTI #
M2S090T-FG676
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Avnet Americas | M2S090T-FG676 - Trays (Alt: M2S090T-FG676) RoHS: Not Compliant Min Qty: 40 Package Multiple: 40 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
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$258.5100 / $277.5200 | Buy Now |
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DISTI #
494-M2S090T-FG676
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Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs RoHS: Not Compliant | 0 |
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$277.5200 | Order Now |
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DISTI #
M2S090T-FG676
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Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 86KLEs, Projected EOL: 2049-02-04 RoHS: Compliant pbFree: Yes |
0 Alternates Available |
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$131.9900 / $277.5200 | Buy Now |
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Onlinecomponents.com | RoHS: Compliant | 0 |
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$241.6600 / $679.3900 | Buy Now |
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NAC | M2S090T-FG676 RoHS: Compliant Min Qty: 40 Package Multiple: 40 Container: Tray | 0 |
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$230.1500 / $269.6000 | Buy Now |
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Master Electronics | RoHS: Compliant | 0 |
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$241.6600 / $679.3900 | Buy Now |
Part Details for M2S090T-FG676
M2S090T-FG676 CAD Models
M2S090T-FG676 Part Data Attributes
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M2S090T-FG676
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
M2S090T-FG676
Microchip Technology Inc
Field Programmable Gate Array, 86316-Cell, CMOS, PBGA676
|
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
| Package Description | FBGA-676 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 10 Weeks | |
| JESD-30 Code | S-PBGA-B676 | |
| JESD-609 Code | e0 | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Inputs | 425 | |
| Number of Logic Cells | 86316 | |
| Number of Outputs | 425 | |
| Number of Terminals | 676 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA676,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Packing Method | TRAY | |
| Peak Reflow Temperature (Cel) | 240 | |
| Programmable Logic Type | FPGA SOC | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.44 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 27 mm |