| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
32AJ8333
|
Newark | Smartfusion2 Soc Fpga, Arm Cortex-M3, 12Kles 256 Lfbga 14X14X1.56Mm Tray Rohs Compliant: Yes |Microchip M2S010-VF256I Min Qty: 119 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$41.0800 / $43.4600 | Buy Now | |
|
DISTI #
M2S010-VF256I-ND
|
DigiKey | IC SOC CORTEX-M3 166MHZ 256FBGA Min Qty: 119 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
|
$43.4601 | Buy Now | |
|
DISTI #
M2S010-VF256I
|
Avnet Americas | - Trays (Alt: M2S010-VF256I) RoHS: Not Compliant Min Qty: 119 Package Multiple: 119 Lead time: 10 Weeks, 0 Days Container: Tray | 0 |
|
$41.0800 / $44.1100 | Buy Now | |
|
DISTI #
494-M2S010-VF256I
|
Mouser Electronics | SoC FPGA SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs RoHS: Not Compliant | 0 |
|
$43.4600 / $44.1100 | Order Now | |
|
DISTI #
M2S010-VF256I
|
Microchip Technology Inc | SmartFusion2 SoC FPGA, ARM Cortex-M3, 12KLEs, Projected EOL: 2049-02-04 RoHS: Compliant pbFree: Yes |
0 Alternates Available |
|
$20.9800 / $44.1100 | Buy Now | |
| Onlinecomponents.com | RoHS: Compliant | 0 |
|
$36.9300 / $101.1500 | Buy Now | ||
| NAC | M2S010-VF256I RoHS: Compliant Min Qty: 119 Package Multiple: 119 Container: Tray | 0 |
|
$36.5900 / $42.8600 | Buy Now | ||
|
DISTI #
M2S010-VF256I
|
EBV Elektronik | SMARTFUSION2 (Alt: M2S010-VF256I) RoHS: Compliant Min Qty: 119 Package Multiple: 119 Lead time: 11 Weeks, 0 Days | EBV - 0 |
|
Buy Now | ||
| Master Electronics | RoHS: Compliant | 0 |
|
$36.9300 / $101.1500 | Buy Now |
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
MICROCHIP TECHNOLOGY INC
|
|
Package Description
|
VFBGA-256
|
|
Reach Compliance Code
|
not_compliant
|
|
HTS Code
|
8542.31.00.01
|
|
Factory Lead Time
|
10 Weeks
|
|
Samacsys Manufacturer
|
Microchip
|
|
JESD-30 Code
|
S-PBGA-B256
|
|
Length
|
14 mm
|
|
Number of Inputs
|
138
|
|
Number of Logic Cells
|
12084
|
|
Number of Outputs
|
138
|
|
Number of Terminals
|
256
|
|
Operating Temperature-Max
|
100 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LFBGA
|
|
Package Equivalence Code
|
BGA256,16X16,32
|
|
Package Shape
|
SQUARE
|
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
240
|
|
Programmable Logic Type
|
FPGA SOC
|
|
Seated Height-Max
|
1.56 mm
|
|
Supply Voltage-Max
|
1.26 V
|
|
Supply Voltage-Min
|
1.14 V
|
|
Supply Voltage-Nom
|
1.2 V
|
|
Surface Mount
|
YES
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
14 mm
|
