Datasheets
M27C801-60F6X by: STMicroelectronics

1MX8 UVPROM, 60ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32

Part Details for M27C801-60F6X by STMicroelectronics

Overview of M27C801-60F6X by STMicroelectronics

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Applications Consumer Electronics Industrial Automation

Part Details for M27C801-60F6X

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M27C801-60F6X Part Data Attributes

M27C801-60F6X STMicroelectronics
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M27C801-60F6X STMicroelectronics 1MX8 UVPROM, 60ns, CDIP32, FRIT SEALED, WINDOWED, CERAMIC, DIP-32
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description FRIT SEALED, WINDOWED, CERAMIC, DIP-32
Pin Count 32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 60 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T32
JESD-609 Code e3
Length 41.885 mm
Memory Density 8388608 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.97 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M27C801-60F6X

This table gives cross-reference parts and alternative options found for M27C801-60F6X. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C801-60F6X, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M27C801-60F1TR 1MX8 UVPROM, 60ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics M27C801-60F6X vs M27C801-60F1TR
M27C801-60F6TR 1MX8 UVPROM, 60ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics M27C801-60F6X vs M27C801-60F6TR
Part Number Description Manufacturer Compare
M27V801-120P1TR 1MX8 OTPROM, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics M27C801-60F6X vs M27V801-120P1TR
M27C801-150B6 1MX8 OTPROM, 150ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 STMicroelectronics M27C801-60F6X vs M27C801-150B6
MX27C8000API-10 OTP ROM, 1MX8, 100ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd M27C801-60F6X vs MX27C8000API-10
HY23V08000D-70 MASK ROM, 1MX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 SK Hynix Inc M27C801-60F6X vs HY23V08000D-70
M27V801-150P6 1MX8 OTPROM, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics M27C801-60F6X vs M27V801-150P6
AT27LV080-20DI UVPROM, 1MX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation M27C801-60F6X vs AT27LV080-20DI
M27C801-150B1TR 1MX8 OTPROM, 150ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 STMicroelectronics M27C801-60F6X vs M27C801-150B1TR
AM27X080-125PC OTP ROM, 1MX8, 120ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD M27C801-60F6X vs AM27X080-125PC
M27C801-45B6TR 1MX8 OTPROM, 45ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 STMicroelectronics M27C801-60F6X vs M27C801-45B6TR
M27W801-100B6TR 1MX8 OTPROM, 100ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics M27C801-60F6X vs M27W801-100B6TR

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