Part Details for M27C64AF by STMicroelectronics
Overview of M27C64AF by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Part Details for M27C64AF
M27C64AF CAD Models
M27C64AF Part Data Attributes
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M27C64AF
STMicroelectronics
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Datasheet
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M27C64AF
STMicroelectronics
8KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | WDIP, | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 150 ns | |
JESD-30 Code | R-GDIP-T28 | |
Length | 36.92 mm | |
Memory Density | 65536 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8KX8 | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.72 mm | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for M27C64AF
This table gives cross-reference parts and alternative options found for M27C64AF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C64AF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27C64-155DIB | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C64AF vs AM27C64-155DIB |
AM27C64-150/BXA | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C64AF vs AM27C64-150/BXA |
M27C64A-15F1 | 8KX8 UVPROM, 150ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | M27C64AF vs M27C64A-15F1 |
TMS27C64-15JE4 | 8KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M27C64AF vs TMS27C64-15JE4 |
M27C64A-15F6 | 8KX8 UVPROM, 150ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | M27C64AF vs M27C64A-15F6 |
TMS27C64-15JL | 8KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M27C64AF vs TMS27C64-15JL |
AM27C64-155DC | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C64AF vs AM27C64-155DC |
NMC27C64Q150 | IC 8K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | National Semiconductor Corporation | M27C64AF vs NMC27C64Q150 |
NMC27C64Q15 | IC 8K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM | Texas Instruments | M27C64AF vs NMC27C64Q15 |
M27C64A-15F6X | 8KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | M27C64AF vs M27C64A-15F6X |