Part Details for M27C64A-30F1 by STMicroelectronics
Overview of M27C64A-30F1 by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| HD64F2630F16LV | Renesas Electronics Corporation | High-end Microcontrollers for Automotive Control and Factory Automation Applications (Non Promotion) | |
| FLA214130F1 | Amphenol Communications Solutions | FLA Receptacle NEMA ANSI C136.41, 3 Power, 2 Signal, 14AWG, 105C, with Panel Gasket EPDM Rubber | |
| FLA414230F1 | Amphenol Communications Solutions | FLA Receptacle NEMA ANSI C136.41, 3 Power, 4 Signal, 14AWG, 150C, with Panel Gasket EPDM Rubber |
Price & Stock for M27C64A-30F1
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Quest Components | UVPROM, 8KX8, 300NS, CMOS, CDIP28 | 5 |
|
$13.6500 | Buy Now |
Part Details for M27C64A-30F1
M27C64A-30F1 CAD Models
M27C64A-30F1 Part Data Attributes
|
|
M27C64A-30F1
STMicroelectronics
Buy Now
Datasheet
|
Compare Parts:
M27C64A-30F1
STMicroelectronics
8KX8 UVPROM, 300ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e3 | |
| Length | 36.92 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.5 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.97 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M27C64A-30F1
This table gives cross-reference parts and alternative options found for M27C64A-30F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C64A-30F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM27C64-30Z-W | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | FUJITSU Semiconductor Limited | M27C64A-30F1 vs MBM27C64-30Z-W |
| TMS27C64-30JL | 8KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | M27C64A-30F1 vs TMS27C64-30JL |
| 27C64MQG/B30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | M27C64A-30F1 vs 27C64MQG/B30 |
| AM27C64-300DI | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C64A-30F1 vs AM27C64-300DI |
| MBM27C64-30-XZ | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | M27C64A-30F1 vs MBM27C64-30-XZ |
| 27C64MQG/B30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | M27C64A-30F1 vs 27C64MQG/B30 |
| MBM27C64-30Z | EPROM, 8KX8, 300ns, CMOS, CDIP28, | FUJITSU Limited | M27C64A-30F1 vs MBM27C64-30Z |
| QD2764-3 | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | M27C64A-30F1 vs QD2764-3 |
| MBM2764-30Z | UVPROM, 8KX8, 300ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | M27C64A-30F1 vs MBM2764-30Z |
| AM27C64-300DE | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C64A-30F1 vs AM27C64-300DE |