Part Details for M27C400-100XF1 by STMicroelectronics
Overview of M27C400-100XF1 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
Renewable Energy
Robotics and Drones
Part Details for M27C400-100XF1
M27C400-100XF1 CAD Models
M27C400-100XF1 Part Data Attributes
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M27C400-100XF1
STMicroelectronics
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Datasheet
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M27C400-100XF1
STMicroelectronics
256KX16 UVPROM, 100ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | STMICROELECTRONICS | |
Part Package Code | DIP | |
Package Description | FRIT SEALED, WINDOWED, CERAMIC, DIP-40 | |
Pin Count | 40 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 100 ns | |
Alternate Memory Width | 8 | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T40 | |
JESD-609 Code | e0 | |
Length | 52.195 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | UVPROM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 40 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP40,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.97 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.07 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for M27C400-100XF1
This table gives cross-reference parts and alternative options found for M27C400-100XF1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C400-100XF1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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AM27C400-105DC | UVPROM, 512KX8, 100ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 | AMD | M27C400-100XF1 vs AM27C400-105DC |