Datasheets
M27C400-100XF1 by: STMicroelectronics

256KX16 UVPROM, 100ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40

Part Details for M27C400-100XF1 by STMicroelectronics

Overview of M27C400-100XF1 by STMicroelectronics

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications Renewable Energy Robotics and Drones

Part Details for M27C400-100XF1

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M27C400-100XF1 Part Data Attributes

M27C400-100XF1 STMicroelectronics
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M27C400-100XF1 STMicroelectronics 256KX16 UVPROM, 100ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description FRIT SEALED, WINDOWED, CERAMIC, DIP-40
Pin Count 40
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 100 ns
Alternate Memory Width 8
I/O Type COMMON
JESD-30 Code R-GDIP-T40
JESD-609 Code e0
Length 52.195 mm
Memory Density 4194304 bit
Memory IC Type UVPROM
Memory Width 16
Number of Functions 1
Number of Terminals 40
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX16
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.97 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M27C400-100XF1

This table gives cross-reference parts and alternative options found for M27C400-100XF1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C400-100XF1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C400-105DC UVPROM, 512KX8, 100ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD M27C400-100XF1 vs AM27C400-105DC
Part Number Description Manufacturer Compare
AM27C4096-200DEB UVPROM, 256KX16, 200ns, CMOS, CDIP40, CERAMIC, DIP-40 Spansion M27C400-100XF1 vs AM27C4096-200DEB
M27C4002-80B6TR 256KX16 UVPROM, 80ns, PDIP40, 0.600 INCH, LEAD FREE, PLASTIC, DIP-40 STMicroelectronics M27C400-100XF1 vs M27C4002-80B6TR
M27W402-200F6 256KX16 UVPROM, 120ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics M27C400-100XF1 vs M27W402-200F6
M27C4002-12XF1 256KX16 UVPROM, 120ns, CDIP40, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-40 STMicroelectronics M27C400-100XF1 vs M27C4002-12XF1
TMS27C040-12JL4 512KX8 UVPROM, 120ns, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 Texas Instruments M27C400-100XF1 vs TMS27C040-12JL4
M27C4002-15B1TR 256KX16 UVPROM, 150ns, PDIP40, 0.600 INCH, LEAD FREE, PLASTIC, DIP-40 STMicroelectronics M27C400-100XF1 vs M27C4002-15B1TR
AM27C4096-255DE UVPROM, 256KX16, 250ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD M27C400-100XF1 vs AM27C4096-255DE
AM27C400-120DI UVPROM, 512KX8, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD M27C400-100XF1 vs AM27C400-120DI
M27C400-80F1 256KX16 UVPROM, 80ns, CDIP40, FRIT SEALED, WINDOWED, CERAMIC, DIP-40 STMicroelectronics M27C400-100XF1 vs M27C400-80F1
AM27C4096-150DC UVPROM, 256KX16, 150ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD M27C400-100XF1 vs AM27C4096-150DC

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