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Part Details for M27C256B-12F6 by STMicroelectronics
Overview of M27C256B-12F6 by STMicroelectronics
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Price & Stock for M27C256B-12F6
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
56P9192
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Newark | Eprom |Stmicroelectronics M27C256B-12F6 Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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Bristol Electronics | 1 |
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RFQ | ||
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Component Electronics, Inc | IN STOCK SHIP TODAY | 16 |
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$3.0000 / $4.6200 | Buy Now |
Part Details for M27C256B-12F6
M27C256B-12F6 CAD Models
M27C256B-12F6 Part Data Attributes:
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M27C256B-12F6
STMicroelectronics
Buy Now
Datasheet
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Compare Parts:
M27C256B-12F6
STMicroelectronics
32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Access Time-Max | 120 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e3 | |
| Length | 36.92 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.72 mm | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M27C256B-12F6
This table gives cross-reference parts and alternative options found for M27C256B-12F6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C256B-12F6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AS27C256-12JM | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Micross Components | M27C256B-12F6 vs AS27C256-12JM |
| AM27C256-125DCB | UVPROM, 32KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C256B-12F6 vs AM27C256-125DCB |
| FT27C256R-12DM/883 | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERAMIC, DIP-28 | Force Technologies Ltd | M27C256B-12F6 vs FT27C256R-12DM/883 |
| FT27C256R-12DC | UVPROM, 32KX8, 12ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 | Force Technologies Ltd | M27C256B-12F6 vs FT27C256R-12DC |
| M27C256B-12F6E | 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | M27C256B-12F6 vs M27C256B-12F6E |
| TMS27C256-12JE | 32KX8 UVPROM, 120ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 | Texas Instruments | M27C256B-12F6 vs TMS27C256-12JE |
| NM27C256QE120 | UVPROM, 32KX8, 120ns, CMOS, CDIP28, WINDOWED, CERDIP-28 | Fairchild Semiconductor Corporation | M27C256B-12F6 vs NM27C256QE120 |
| MX27C256DC-12 | UVPROM, 32KX8, 120ns, CMOS, CDIP28, CERAMIC, DIP-28 | Macronix International Co Ltd | M27C256B-12F6 vs MX27C256DC-12 |
| CAT27HC256LD-12 | UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERDIP-28 | Catalyst Semiconductor | M27C256B-12F6 vs CAT27HC256LD-12 |
| M27C256B-12F1X | 32KX8 UVPROM, 120ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | M27C256B-12F6 vs M27C256B-12F1X |