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Overview of M25P05-AVDW6P by Micron Technology Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for M25P05-AVDW6P by Micron Technology Inc
Part Data Attributes for M25P05-AVDW6P by Micron Technology Inc
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Rohs Code
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Yes
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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MICRON TECHNOLOGY INC
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Package Description
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TSSOP, TSSOP8,.25
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.51
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Clock Frequency-Max (fCLK)
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50 MHz
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Endurance
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100000 Write/Erase Cycles
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JESD-30 Code
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R-PDSO-G8
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Memory Density
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524288 bit
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Memory IC Type
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FLASH
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Memory Width
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8
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Number of Terminals
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8
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Number of Words
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65536 words
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Number of Words Code
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64000
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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64KX8
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TSSOP
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Package Equivalence Code
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TSSOP8,.25
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Package Shape
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RECTANGULAR
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Package Style
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SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
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Parallel/Serial
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SERIAL
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Qualification Status
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Not Qualified
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Serial Bus Type
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SPI
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Standby Current-Max
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0.000005 A
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Supply Current-Max
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0.015 mA
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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GULL WING
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Terminal Pitch
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0.635 mm
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Terminal Position
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DUAL
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Type
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NOR TYPE
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Write Protection
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HARDWARE/SOFTWARE
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