Part Details for LTC6088CDHC#TR by Linear Technology
Overview of LTC6088CDHC#TR by Linear Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Audio and Video Systems
Computing and Data Storage
Smart Cities
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LTC6088CDHC#TRPBF | Analog Devices | 4x 14MHz, R2R CMOS Amps | |
| LTC6088CDHC#PBF | Analog Devices | 4x 14MHz, R2R CMOS Amps |
Part Details for LTC6088CDHC#TR
LTC6088CDHC#TR CAD Models
LTC6088CDHC#TR Part Data Attributes
|
|
LTC6088CDHC#TR
Linear Technology
Buy Now
Datasheet
|
Compare Parts:
LTC6088CDHC#TR
Linear Technology
LTC6088 - Quad 14MHz, Rail-to-Rail CMOS Amplifiers; Package: DFN; Pins: 16; Temperature Range: 0°C to 70°C
|
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LINEAR TECHNOLOGY CORP | |
| Part Package Code | DFN | |
| Package Description | HVSON, | |
| Pin Count | 16 | |
| Manufacturer Package Code | DHC | |
| Reach Compliance Code | not_compliant | |
| Amplifier Type | OPERATIONAL AMPLIFIER | |
| Average Bias Current-Max (IIB) | 0.00004 µA | |
| Common-mode Reject Ratio-Nom | 80 dB | |
| Input Offset Voltage-Max | 1350 µV | |
| JESD-30 Code | R-PDSO-N16 | |
| JESD-609 Code | e0 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 4 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC16,.12,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Packing Method | TR | |
| Seated Height-Max | 0.8 mm | |
| Slew Rate-Nom | 7.2 V/us | |
| Supply Voltage Limit-Max | 6 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Unity Gain BW-Nom | 14000 | |
| Width | 3 mm |