Part Details for LSP1011-254 by Microsemi Corporation
Overview of LSP1011-254 by Microsemi Corporation
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Applications
Consumer Electronics
Audio and Video Systems
Part Details for LSP1011-254
LSP1011-254 CAD Models
LSP1011-254 Part Data Attributes
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LSP1011-254
Microsemi Corporation
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LSP1011-254
Microsemi Corporation
Pin Diode, 200V V(BR), Silicon, CERAMIC PLASTIC PACKAGE-3
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICROSEMI CORP | |
Package Description | R-XBCC-N3 | |
Pin Count | 3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00.80 | |
Application | ATTENUATOR | |
Breakdown Voltage-Min | 200 V | |
Configuration | SINGLE | |
Diode Capacitance-Max | 0.35 pF | |
Diode Element Material | SILICON | |
Diode Forward Resistance-Max | 2 Ω | |
Diode Type | PIN DIODE | |
Frequency Band | C BAND | |
JESD-30 Code | R-XBCC-N3 | |
JESD-609 Code | e0 | |
Minority Carrier Lifetime-Nom | 2 µs | |
Number of Elements | 1 | |
Number of Terminals | 3 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Power Dissipation-Max | 0.5 W | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Technology | POSITIVE-INTRINSIC-NEGATIVE | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Position | BOTTOM |