Part Details for LSIFC919X by LSI Corporation
Overview of LSIFC919X by LSI Corporation
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Part Details for LSIFC919X
LSIFC919X CAD Models
LSIFC919X Part Data Attributes:
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LSIFC919X
LSI Corporation
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LSIFC919X
LSI Corporation
FDDI Controller, 1 Channel(s), 256MBps, CMOS, PBGA456, 35 X 35 MM, 1.27 MM PITCH, PLASTIC, MS-034, BGA-456
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | LSI CORP | |
| Part Package Code | BGA | |
| Package Description | 35 X 35 MM, 1.27 MM PITCH, PLASTIC, MS-034, BGA-456 | |
| Pin Count | 456 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 64 | |
| Boundary Scan | YES | |
| Bus Compatibility | PCI | |
| Clock Frequency-Max | 106.25 MHz | |
| Communication Protocol | ASYNC, BIT; SYNC, BYTE | |
| Data Transfer Rate-Max | 100 MBps | |
| External Data Bus Width | 64 | |
| JESD-30 Code | S-PBGA-B456 | |
| JESD-609 Code | e0 | |
| Length | 35 mm | |
| Low Power Mode | YES | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 456 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA456,26X26,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | SERIAL IO/COMMUNICATION CONTROLLER, FDDI |