Part Details for LPC1825JET100/MP1E by NXP Semiconductors
Overview of LPC1825JET100/MP1E by NXP Semiconductors
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Part Details for LPC1825JET100/MP1E
LPC1825JET100/MP1E CAD Models
LPC1825JET100/MP1E Part Data Attributes
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LPC1825JET100/MP1E
NXP Semiconductors
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LPC1825JET100/MP1E
NXP Semiconductors
LPC1825JET100 - High Performance 32-bit Microcontroller based on ARM Cortex-M3 BGA 100-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | TFBGA, | |
Pin Count | 100 | |
Manufacturer Package Code | SOT926-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M3 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | ||
Length | 9 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 49 | |
Number of Terminals | 100 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 139264 | |
ROM (words) | 786432 | |
ROM Programmability | FLASH | |
Speed | 180 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 9 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |