Part Details for LPC1225FBD64/201,1 by NXP Semiconductors
Overview of LPC1225FBD64/201,1 by NXP Semiconductors
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Part Details for LPC1225FBD64/201,1
LPC1225FBD64/201,1 CAD Models
LPC1225FBD64/201,1 Part Data Attributes
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LPC1225FBD64/201,1
NXP Semiconductors
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LPC1225FBD64/201,1
NXP Semiconductors
LPC1225FBD64 - 80kB flash, 8kB SRAM, LQFP64 package QFP 64-Pin
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFP | |
| Pin Count | 64 | |
| Manufacturer Package Code | SOT314-2 | |
| Reach Compliance Code | unknown | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G64 | |
| Length | 14 mm | |
| Number of I/O Lines | 55 | |
| Number of Terminals | 64 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP64,.47SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 8192 | |
| ROM (words) | 65536 | |
| ROM Programmability | FLASH | |
| Speed | 45 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |