LM28C65-250/B
LSI Corporation
Description: EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32

Overview of LM28C65-250/B by LSI Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Education and Research Internet of Things (IoT) Industrial Automation Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Electronic Manufacturing Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
GA3250-BLC Coilcraft Inc General Purpose Inductor, 112uH, 20%, 2 Element, Ferrite-Core, SMD, 1212, CHIP, 1212, ROHS COMPLIANT
GA3250-BLB Coilcraft Inc General Purpose Inductor, 112uH, 20%, 2 Element, Ferrite-Core, SMD, 1212, CHIP, 1212, ROHS COMPLIANT
GA3250-BL Coilcraft Inc Coupled inductor, for MAX 14521E, SMT, RoHS

CAD Models for LM28C65-250/B by LSI Corporation
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Part Data Attributes for LM28C65-250/B by LSI Corporation

LM28C65-250/B
LSI Corporation
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SEEQ TECHNOLOGY INC
Package Description
QCCN, LCC32,.45X.55
Reach Compliance Code
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.51
Access Time-Max
250 ns
Additional Feature
AUTOMATIC WRITE;PAGE WRITE
Command User Interface
NO
Data Polling
YES
JESD-30 Code
R-CQCC-N32
JESD-609 Code
e0
Memory Density
65536 bit
Memory IC Type
EEPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
Package Equivalence Code
LCC32,.45X.55
Package Shape
RECTANGULAR
Package Style
CHIP CARRIER
Page Size
64 words
Parallel/Serial
PARALLEL
Programming Voltage
5 V
Qualification Status
Not Qualified
Ready/Busy
YES
Screening Level
38535Q/M;38534H;883B
Standby Current-Max
0.00025 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
QUAD
Toggle Bit
NO
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  1. LM28C65-250/B
    LSI Corporation
    EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32
    VS

Alternate Parts for LM28C65-250/B

This table gives cross-reference parts and alternative options found for LM28C65-250/B. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LM28C65-250/B, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
28C64AF-25I/K 8K X 8 EEPROM 5V, 250 ns, CQCC32, CERAMIC, LCC-32 Microchip Technology Inc LM28C65-250/B vs 28C64AF-25I/K
PYA28C64E-25LMB EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, 0.450 X 0.550 INCH, CERAMIC, LCC-32 Pyramid Semiconductor Corporation LM28C65-250/B vs PYA28C64E-25LMB
5962-8751408YX EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32 QP Semiconductor LM28C65-250/B vs 5962-8751408YX
28C64AX-25I/K 8K X 8 EEPROM 5V, 250 ns, CQCC32, CERAMIC, LCC-32 Microchip Technology Inc LM28C65-250/B vs 28C64AX-25I/K
LM28C65-250 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32 LSI Corporation LM28C65-250/B vs LM28C65-250
AM9864-25LI EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C65-250/B vs AM9864-25LI
X2864AE-25 EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C65-250/B vs X2864AE-25
X28C64EM-25 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C65-250/B vs X28C64EM-25
LM52B33-250/B EEPROM, 8KX8, 250ns, Parallel, MOS, CQCC32 LSI Corporation LM28C65-250/B vs LM52B33-250/B
AM2864AE-250LEB EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C65-250/B vs AM2864AE-250LEB
Part Number Description Manufacturer Compare
X28C64GI-25 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 Xicor Inc LM28C65-250/B vs X28C64GI-25
AM2864AE-255LE EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C65-250/B vs AM2864AE-255LE
AM9864-25LI EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C65-250/B vs AM9864-25LI
28C64AX-25I/K 8K X 8 EEPROM 5V, 250 ns, CQCC32, CERAMIC, LCC-32 Microchip Technology Inc LM28C65-250/B vs 28C64AX-25I/K
AT28PC64-25LM/883 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32 Atmel Corporation LM28C65-250/B vs AT28PC64-25LM/883
AM2864AE-255LIB EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C65-250/B vs AM2864AE-255LIB
X2864AE-25 EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 Xicor Inc LM28C65-250/B vs X2864AE-25
AM2864AE-250LC EEPROM, 8KX8, 250ns, Parallel, NMOS, CQCC32, CERAMIC, LCC-32 AMD LM28C65-250/B vs AM2864AE-250LC
28C64AX-25/K 8K X 8 EEPROM 5V, 250 ns, CQCC32, CERAMIC, LCC-32 Microchip Technology Inc LM28C65-250/B vs 28C64AX-25/K
X28C64GM-25 EEPROM, 8KX8, 250ns, Parallel, CMOS, CQCC32, FRIT SEALED, CERAMIC, LCC-32 Xicor Inc LM28C65-250/B vs X28C64GM-25

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