Part Details for KS58D23N by Samsung Semiconductor
Overview of KS58D23N by Samsung Semiconductor
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for KS58D23N
KS58D23N CAD Models
KS58D23N Part Data Attributes
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KS58D23N
Samsung Semiconductor
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Datasheet
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KS58D23N
Samsung Semiconductor
Telephone Circuit, CMOS, PDIP18
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Package Description | DIP, DIP18,.3 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Crystal Frequency | 3.58 MHz | |
JESD-30 Code | R-PDIP-T18 | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 18 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | -20 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP18,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Qualification Status | Not Qualified | |
Repertory | REPERTORY | |
Supply Current-Max | 0.001 mA | |
Supply Voltage-Nom | 3.5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |