Part Details for KS57C0208N-XX by Samsung Semiconductor
Overview of KS57C0208N-XX by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for KS57C0208N-XX
KS57C0208N-XX CAD Models
KS57C0208N-XX Part Data Attributes
|
KS57C0208N-XX
Samsung Semiconductor
Buy Now
Datasheet
|
Compare Parts:
KS57C0208N-XX
Samsung Semiconductor
Microcontroller, 4-Bit, MROM, SAM4 CPU, 1.05MHz, CMOS, PDIP24
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | DIP | |
Package Description | SDIP, SDIP24,.3 | |
Pin Count | 24 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Bit Size | 4 | |
CPU Family | SAM4 | |
JESD-30 Code | R-PDIP-T24 | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SDIP | |
Package Equivalence Code | SDIP24,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, SHRINK PITCH | |
Qualification Status | Not Qualified | |
RAM (bytes) | 256 | |
ROM (words) | 8192 | |
ROM Programmability | MROM | |
Speed | 1.05 MHz | |
Supply Current-Max | 4 mA | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 1.78 mm | |
Terminal Position | DUAL |