Part Details for KMM58256AP8 by Samsung Semiconductor
Overview of KMM58256AP8 by Samsung Semiconductor
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Part Details for KMM58256AP8
KMM58256AP8 CAD Models
KMM58256AP8 Part Data Attributes
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KMM58256AP8
Samsung Semiconductor
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Datasheet
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KMM58256AP8
Samsung Semiconductor
Page Mode DRAM, 256KX8, 80ns, CMOS, PSMA30
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Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Package Description | SIMM, SIM30 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.02 | |
Access Time-Max | 80 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PSMA-N30 | |
Memory Density | 2097152 bit | |
Memory IC Type | PAGE MODE DRAM | |
Memory Width | 8 | |
Number of Terminals | 30 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SIMM | |
Package Equivalence Code | SIM30 | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Qualification Status | Not Qualified | |
Refresh Cycles | 512 | |
Supply Current-Max | 0.15 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 2.54 mm | |
Terminal Position | SINGLE |