Datasheets
KMM58256AP8 by: Samsung Semiconductor

Page Mode DRAM, 256KX8, 80ns, CMOS, PSMA30

Part Details for KMM58256AP8 by Samsung Semiconductor

Overview of KMM58256AP8 by Samsung Semiconductor

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Part Details for KMM58256AP8

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KMM58256AP8 Part Data Attributes

KMM58256AP8 Samsung Semiconductor
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KMM58256AP8 Samsung Semiconductor Page Mode DRAM, 256KX8, 80ns, CMOS, PSMA30
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description SIMM, SIM30
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Time-Max 80 ns
I/O Type COMMON
JESD-30 Code R-PSMA-N30
Memory Density 2097152 bit
Memory IC Type PAGE MODE DRAM
Memory Width 8
Number of Terminals 30
Number of Words 262144 words
Number of Words Code 256000
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code SIMM
Package Equivalence Code SIM30
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified
Refresh Cycles 512
Supply Current-Max 0.15 mA
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form NO LEAD
Terminal Pitch 2.54 mm
Terminal Position SINGLE

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