Memory
KM6264BLP-12L
Samsung Semiconductor
Description: Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.600 INCH, DIP-28

Overview of KM6264BLP-12L by Samsung Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

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Part Data Attributes for KM6264BLP-12L by Samsung Semiconductor

KM6264BLP-12L
Samsung Semiconductor
-
-
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
Package Description
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
120 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T28
Length
36.32 mm
Memory Density
65536 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Ports
1
Number of Terminals
28
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Standby Current-Max
0.000005 A
Standby Voltage-Min
2 V
Supply Current-Max
0.055 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Want to compare parts?
  1. KM6264BLP-12L
    Samsung Semiconductor
    Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.600 INCH, DIP-28
    VS

Alternate Parts for KM6264BLP-12L

This table gives cross-reference parts and alternative options found for KM6264BLP-12L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of KM6264BLP-12L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CXK5864BSP-12L Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28 Sony Semiconductor KM6264BLP-12L vs CXK5864BSP-12L
AM99C88-12DE Standard SRAM, 8KX8, 120ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 AMD KM6264BLP-12L vs AM99C88-12DE
UPD4364C-12LL Standard SRAM, 8KX8, 120ns, MIXMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 NEC Electronics America Inc KM6264BLP-12L vs UPD4364C-12LL
MK48H64N-120 8KX8 STANDARD SRAM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 STMicroelectronics KM6264BLP-12L vs MK48H64N-120
HM6264P-12 8KX8 STANDARD SRAM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Renesas Electronics Corporation KM6264BLP-12L vs HM6264P-12
SRM2264LC12 Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Seiko Epson Corporation KM6264BLP-12L vs SRM2264LC12
TC5565APL-12L IC 8K X 8 STANDARD SRAM, 120 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components KM6264BLP-12L vs TC5565APL-12L
TC5565APL-12 IC 8K X 8 STANDARD SRAM, 120 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components KM6264BLP-12L vs TC5565APL-12
MK48H64LN-120 8KX8 STANDARD SRAM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 STMicroelectronics KM6264BLP-12L vs MK48H64LN-120
AM99C88-12DC Standard SRAM, 8KX8, 120ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 AMD KM6264BLP-12L vs AM99C88-12DC
Part Number Description Manufacturer Compare
SRM2264LC12 Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Seiko Epson Corporation KM6264BLP-12L vs SRM2264LC12
UPD4364C-12LL Standard SRAM, 8KX8, 120ns, MIXMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 NEC Electronics America Inc KM6264BLP-12L vs UPD4364C-12LL
MK48H64LN-120 8KX8 STANDARD SRAM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 STMicroelectronics KM6264BLP-12L vs MK48H64LN-120
MK48H64N-120 8KX8 STANDARD SRAM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 STMicroelectronics KM6264BLP-12L vs MK48H64N-120
TC5565APL-12 IC 8K X 8 STANDARD SRAM, 120 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components KM6264BLP-12L vs TC5565APL-12
CXK5864BSP-12L Standard SRAM, 8KX8, 120ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, MO-058AB, DIP-28 Sony Semiconductor KM6264BLP-12L vs CXK5864BSP-12L
AM99C88-12DE Standard SRAM, 8KX8, 120ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-28 AMD KM6264BLP-12L vs AM99C88-12DE
TC5565APL-12L IC 8K X 8 STANDARD SRAM, 120 ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28, Static RAM Toshiba America Electronic Components KM6264BLP-12L vs TC5565APL-12L
UPD4364C-12L Standard SRAM, 8KX8, 120ns, MIXMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 NEC Electronics America Inc KM6264BLP-12L vs UPD4364C-12L
HM6264P-12 8KX8 STANDARD SRAM, 120ns, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Renesas Electronics Corporation KM6264BLP-12L vs HM6264P-12

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