There are no models available for this part yet.
Overview of K9F1G08U0A-JCB00 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 4 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for K9F1G08U0A-JCB00 by Samsung Semiconductor
Part Data Attributes for K9F1G08U0A-JCB00 by Samsung Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code
|
BGA
|
Package Description
|
TFBGA, BGA63,10X12,32
|
Pin Count
|
63
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Access Time-Max
|
20 ns
|
Command User Interface
|
YES
|
Data Polling
|
NO
|
JESD-30 Code
|
R-PBGA-B63
|
Length
|
12 mm
|
Memory Density
|
1073741824 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Sectors/Size
|
1K
|
Number of Terminals
|
63
|
Number of Words
|
134217728 words
|
Number of Words Code
|
128000000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
128MX8
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TFBGA
|
Package Equivalence Code
|
BGA63,10X12,32
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Page Size
|
2K words
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Programming Voltage
|
2.7 V
|
Qualification Status
|
Not Qualified
|
Ready/Busy
|
YES
|
Seated Height-Max
|
1.2 mm
|
Sector Size
|
128K
|
Standby Current-Max
|
0.00005 A
|
Supply Current-Max
|
0.03 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Toggle Bit
|
NO
|
Type
|
SLC NAND TYPE
|
Width
|
9.5 mm
|
Alternate Parts for K9F1G08U0A-JCB00
This table gives cross-reference parts and alternative options found for K9F1G08U0A-JCB00. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K9F1G08U0A-JCB00, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
K9F1G08U0A-JIB0T | Flash, 128MX8, 20ns, PBGA63 | Samsung Semiconductor | K9F1G08U0A-JCB00 vs K9F1G08U0A-JIB0T |
K9F1G08U0A-JIB00 | Flash, 128MX8, 20ns, PBGA63, 9.50 X 12 MM, LEAD FREE, FBGA-63 | Samsung Semiconductor | K9F1G08U0A-JCB00 vs K9F1G08U0A-JIB00 |
K9F1G08U0A-JIB0 | Flash, 128MX8, 20ns, PBGA63 | Samsung Semiconductor | K9F1G08U0A-JCB00 vs K9F1G08U0A-JIB0 |
K9F1G08U0A-JCB0 | Flash, 128MX8, 20ns, PBGA63, | Samsung Semiconductor | K9F1G08U0A-JCB00 vs K9F1G08U0A-JCB0 |