Datasheets
K9E2G08U0M-FIB00 by: Samsung Semiconductor

Flash, 256MX8, 30ns, PDSO48, 12 X 17 MM, 0.70 MM HEIGHT, LEAD FREE, PLASTIC, WSOP1-48

Part Details for K9E2G08U0M-FIB00 by Samsung Semiconductor

Overview of K9E2G08U0M-FIB00 by Samsung Semiconductor

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Part Details for K9E2G08U0M-FIB00

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K9E2G08U0M-FIB00 Part Data Attributes

K9E2G08U0M-FIB00 Samsung Semiconductor
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K9E2G08U0M-FIB00 Samsung Semiconductor Flash, 256MX8, 30ns, PDSO48, 12 X 17 MM, 0.70 MM HEIGHT, LEAD FREE, PLASTIC, WSOP1-48
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC
Package Description VSSOP,
Pin Count 48
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 30 ns
Additional Feature CONTAINS ADDITIONAL 64M BIT SPARE MEMORY
JESD-30 Code R-PDSO-G48
JESD-609 Code e6
Length 15.4 mm
Memory Density 2147483648 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 48
Number of Words 268435456 words
Number of Words Code 256000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256MX8
Package Body Material PLASTIC/EPOXY
Package Code VSSOP
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL
Programming Voltage 2.7 V
Qualification Status Not Qualified
Seated Height-Max 0.7 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN BISMUTH
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Width 12 mm

Alternate Parts for K9E2G08U0M-FIB00

This table gives cross-reference parts and alternative options found for K9E2G08U0M-FIB00. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K9E2G08U0M-FIB00, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K9E2G08U0M-FCB00 Flash, 256MX8, 30ns, PDSO48, 12 X 17 MM, 0.70 MM HEIGHT, LEAD FREE, PLASTIC, WSOP1-48 Samsung Semiconductor K9E2G08U0M-FIB00 vs K9E2G08U0M-FCB00
Part Number Description Manufacturer Compare
NAND02GW3B2BN1T 256MX8 FLASH 3V PROM, 35ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 STMicroelectronics K9E2G08U0M-FIB00 vs NAND02GW3B2BN1T
NAND02GW4B2AN1E Flash, 128MX16, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Numonyx Memory Solutions K9E2G08U0M-FIB00 vs NAND02GW4B2AN1E
HY27SG162G2M-TCP Flash, 128MX16, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48 SK Hynix Inc K9E2G08U0M-FIB00 vs HY27SG162G2M-TCP
NAND02GR4B2CN6E Flash, 128MX16, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Numonyx Memory Solutions K9E2G08U0M-FIB00 vs NAND02GR4B2CN6E
HY27SG162G2M-SPCB Flash, 128MX16, 30ns, PDSO48, 12 X 17 MM, 0.65 MM HEIGHT, LEAD FREE, USOP1-48 SK Hynix Inc K9E2G08U0M-FIB00 vs HY27SG162G2M-SPCB
NAND02GR3B3CN1T 256MX8 FLASH 1.8V PROM, 35ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 STMicroelectronics K9E2G08U0M-FIB00 vs NAND02GR3B3CN1T
NAND02GR3B2BN1F Flash, 256MX8, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 Numonyx Memory Solutions K9E2G08U0M-FIB00 vs NAND02GR3B2BN1F
TC58NVG1S3ETAI0 IC 256M X 8 FLASH 3.3V PROM, PDSO48, 12 X 20 MM, 050 MM PITCH, PLASTIC, TSOP-48, Programmable ROM Toshiba America Electronic Components K9E2G08U0M-FIB00 vs TC58NVG1S3ETAI0
NAND02GW3B2BN1F 256MX8 FLASH 3V PROM, 25000ns, PDSO48, 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 STMicroelectronics K9E2G08U0M-FIB00 vs NAND02GW3B2BN1F
NAND02GW3B2CN1T Flash, 256MX8, PDSO48, 12 X 20 MM, PLASTIC, TSOP-48 Micron Technology Inc K9E2G08U0M-FIB00 vs NAND02GW3B2CN1T

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