Part Details for K8D6316UBM-TI070 by Samsung Semiconductor
Overview of K8D6316UBM-TI070 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for K8D6316UBM-TI070
K8D6316UBM-TI070 CAD Models
K8D6316UBM-TI070 Part Data Attributes:
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K8D6316UBM-TI070
Samsung Semiconductor
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Datasheet
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K8D6316UBM-TI070
Samsung Semiconductor
Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, TBGA-48
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | VFBGA, BGA48,6X8,32 | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 70 ns | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PBGA-B48 | |
| Length | 9 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 8,127 | |
| Number of Terminals | 48 | |
| Number of Words | 4194304 words | |
| Number of Words Code | 4000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 4MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA48,6X8,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 2.7 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1 mm | |
| Sector Size | 8K,64K | |
| Standby Current-Max | 0.00003 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 6 mm |
Alternate Parts for K8D6316UBM-TI070
This table gives cross-reference parts and alternative options found for K8D6316UBM-TI070. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K8D6316UBM-TI070, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K8D6316UBMFC0700 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, FBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBMFC0700 |
| K8D6316UBMDI0700 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBMDI0700 |
| K8D6316UBM-LC070 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBM-LC070 |
| K8D6316UBM-FC070 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, FBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBM-FC070 |
| K8D6316UBMLC0700 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, TBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBMLC0700 |
| K8D6316UBM-TC070 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, TBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBM-TC070 |
| K8D6316UBM-DI070 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBM-DI070 |
| K8D6316UBMDC0700 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBMDC0700 |
| K8D6316UBMTC0700 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, TBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBMTC0700 |
| K8D6316UBMFI0700 | Flash, 4MX16, 70ns, PBGA48, 6 X 9 MM, 0.80 MM PITCH, FBGA-48 | Samsung Semiconductor | K8D6316UBM-TI070 vs K8D6316UBMFI0700 |