There are no models available for this part yet.
Overview of K7Z163685A-HC30 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 54HC30FK/B | Rochester Electronics LLC | Replacement for Texas Instruments part number SNJ54HC30FK. Buy from authorized manufacturer Rochester Electronics. | |
| 54HC30/BCA | Rochester Electronics LLC | 54HC30 - 8-Input NAND Gates - Dual marked (M38510/65004BCA) | |
| 74HC30FPEL-E | Renesas Electronics Corporation | HD/RD74HC Series |
CAD Models for K7Z163685A-HC30 by Samsung Semiconductor
Part Data Attributes for K7Z163685A-HC30 by Samsung Semiconductor
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
BGA, BGA209,11X19,40
|
|
Pin Count
|
209
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
2.7 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
300 MHz
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PBGA-B209
|
|
JESD-609 Code
|
e0
|
|
Length
|
22 mm
|
|
Memory Density
|
18874368 bit
|
|
Memory IC Type
|
LATE-WRITE SRAM
|
|
Memory Width
|
36
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
209
|
|
Number of Words
|
524288 words
|
|
Number of Words Code
|
512000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Organization
|
512KX36
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA209,11X19,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
2.2 mm
|
|
Standby Voltage-Min
|
1.7 V
|
|
Supply Voltage-Max (Vsup)
|
1.95 V
|
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
14 mm
|
Alternate Parts for K7Z163685A-HC30
This table gives cross-reference parts and alternative options found for K7Z163685A-HC30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7Z163685A-HC30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS61FSCS51236-8.5B | Standard SRAM, 512KX36, 7.2ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | Integrated Silicon Solution Inc | K7Z163685A-HC30 vs IS61FSCS51236-8.5B |
| GS8170DW36GC-300IT | Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | K7Z163685A-HC30 vs GS8170DW36GC-300IT |
| GS8171DW36AGC-350I | Standard SRAM, 512KX36, 1.7ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209 | GSI Technology | K7Z163685A-HC30 vs GS8171DW36AGC-350I |
| GS8170DW36C-300I | Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | K7Z163685A-HC30 vs GS8170DW36C-300I |
| GS8170DW36AGC-250T | Standard SRAM, 512KX36, 2.1ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209 | GSI Technology | K7Z163685A-HC30 vs GS8170DW36AGC-250T |
| GS8171DW36AGC-350T | Standard SRAM, 512KX36, 1.7ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209 | GSI Technology | K7Z163685A-HC30 vs GS8171DW36AGC-350T |
| IS61NSCS51236-200B | Standard SRAM, 512KX36, 3.1ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | Integrated Silicon Solution Inc | K7Z163685A-HC30 vs IS61NSCS51236-200B |
| GS8170EW36C-300 | Standard SRAM, 512KX36, 5.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | K7Z163685A-HC30 vs GS8170EW36C-300 |
| GS8170LW36GC-333IT | Standard SRAM, 512KX36, 1.8ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | K7Z163685A-HC30 vs GS8170LW36GC-333IT |
| GS8170DD36GC-250IT | Standard SRAM, 512KX36, 2.1ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209 | GSI Technology | K7Z163685A-HC30 vs GS8170DD36GC-250IT |