Part Details for K7R161882B-FI25 by Samsung Semiconductor
Overview of K7R161882B-FI25 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Computing and Data Storage
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Entertainment and Gaming
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| HD6413008VFI25 | Renesas Electronics Corporation | 16-bit Microcontrollers with Embedded 512KB Flash Microcomputer (Non Promotion) | |
| HD64F3052BFI25V | Renesas Electronics Corporation | 16-bit Microcontrollers with Embedded 512KB Flash Microcomputer (Non Promotion), , / | |
| HD64F3068FI25V | Renesas Electronics Corporation | 16-bit Microcontrollers with Embedded 512KB Flash Microcomputer (Non Promotion) |
Part Details for K7R161882B-FI25
K7R161882B-FI25 CAD Models
K7R161882B-FI25 Part Data Attributes
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K7R161882B-FI25
Samsung Semiconductor
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Datasheet
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K7R161882B-FI25
Samsung Semiconductor
Standard SRAM, 1MX18, 0.45ns, CMOS, PBGA165
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Package Description | BGA, BGA165,11X15,40 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| Memory Density | 18874368 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 1MX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.28 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.5 mA | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM |
Alternate Parts for K7R161882B-FI25
This table gives cross-reference parts and alternative options found for K7R161882B-FI25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7R161882B-FI25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| K7R161882B-EI25 | Samsung Semiconductor | Check for Price | Standard SRAM, 1MX18, 0.45ns, CMOS, PBGA165 | K7R161882B-FI25 vs K7R161882B-EI25 |
| K7R161882B-EC25 | Samsung Semiconductor | Check for Price | Standard SRAM, 1MX18, 0.45ns, CMOS, PBGA165 | K7R161882B-FI25 vs K7R161882B-EC25 |