There are no models available for this part yet.
Overview of K7N801809A-HC22 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| 54HC221AJ/883C | Rochester Electronics | Replacement for National Semiconductor part number MM54HC221AJ/883C. Buy from authorized manufacturer Rochester Electronics. | |
| 0603HC-22NXGBW | Coilcraft Inc | General Purpose Inductor, 0.022uH, 2%, 1 Element, Ceramic-Core, SMD, 0704, CHIP | |
| 0603HC-22NXGBU | Coilcraft Inc | General Purpose Inductor, 0.022uH, 2%, 1 Element, Ceramic-Core, SMD, 0704, CHIP |
CAD Models for K7N801809A-HC22 by Samsung Semiconductor
Part Data Attributes for K7N801809A-HC22 by Samsung Semiconductor
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
BGA, BGA119,7X17,50
|
|
Pin Count
|
119
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Access Time-Max
|
2.8 ns
|
|
Clock Frequency-Max (fCLK)
|
225 MHz
|
|
I/O Type
|
COMMON
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|
JESD-30 Code
|
R-PBGA-B119
|
|
JESD-609 Code
|
e0
|
|
Length
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22 mm
|
|
Memory Density
|
9437184 bit
|
|
Memory IC Type
|
ZBT SRAM
|
|
Memory Width
|
18
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
119
|
|
Number of Words
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524288 words
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|
Number of Words Code
|
512000
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|
Operating Mode
|
SYNCHRONOUS
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|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
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|
|
Organization
|
512KX18
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
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PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Equivalence Code
|
BGA119,7X17,50
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY
|
|
Parallel/Serial
|
PARALLEL
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|
Qualification Status
|
Not Qualified
|
|
Standby Current-Max
|
0.01 A
|
|
Standby Voltage-Min
|
3.14 V
|
|
Supply Current-Max
|
0.5 mA
|
|
Supply Voltage-Max (Vsup)
|
3.465 V
|
|
Supply Voltage-Min (Vsup)
|
3.135 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
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Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1.27 mm
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Terminal Position
|
BOTTOM
|
|
Width
|
14 mm
|