Datasheets
K7N323601M-HC160 by: Samsung Semiconductor

ZBT SRAM, 1MX36, 3.5ns, CMOS, PBGA119, BGA-119

Part Details for K7N323601M-HC160 by Samsung Semiconductor

Overview of K7N323601M-HC160 by Samsung Semiconductor

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Available Datasheets

Part # Manufacturer Description Datasheet
54HC160/BEA Rochester Electronics LLC Replacement for Texas Instruments part number 5962-8682401EA. Buy from authorized manufacturer Rochester Electronics.
74HC160FPEL-E Renesas Electronics Corporation HD/RD74HC Series
74HC160P-E Renesas Electronics Corporation HD/RD74HC Series

Part Details for K7N323601M-HC160

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K7N323601M-HC160 Part Data Attributes

K7N323601M-HC160 Samsung Semiconductor
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K7N323601M-HC160 Samsung Semiconductor ZBT SRAM, 1MX36, 3.5ns, CMOS, PBGA119, BGA-119
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description BGA,
Pin Count 119
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3.5 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B119
Length 22 mm
Memory Density 37748736 bit
Memory IC Type ZBT SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 119
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1MX36
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape RECTANGULAR
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 14 mm

Alternate Parts for K7N323601M-HC160

This table gives cross-reference parts and alternative options found for K7N323601M-HC160. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7N323601M-HC160, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS832436B-150 Cache SRAM, 1MX36, 10ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 GSI Technology K7N323601M-HC160 vs GS832436B-150
GS832436GB-225T Cache SRAM, 1MX36, 6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 GSI Technology K7N323601M-HC160 vs GS832436GB-225T
GS8322Z36GB-150T ZBT SRAM, 1MX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 GSI Technology K7N323601M-HC160 vs GS8322Z36GB-150T
GS8324Z36B-250IT ZBT SRAM, 1MX36, 6ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 GSI Technology K7N323601M-HC160 vs GS8324Z36B-250IT
K7N323645M-HC160 ZBT SRAM, 1MX36, 3.5ns, CMOS, PBGA119, BGA-119 Samsung Semiconductor K7N323601M-HC160 vs K7N323645M-HC160
GS8322Z36AGB-333IV ZBT SRAM, 1MX36, 5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119 GSI Technology K7N323601M-HC160 vs GS8322Z36AGB-333IV
K7P323666M-HC250 Late-Write SRAM, 1MX36, 2ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 Samsung Semiconductor K7N323601M-HC160 vs K7P323666M-HC250
GS832236AB-300 Cache SRAM, 1MX36, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119 GSI Technology K7N323601M-HC160 vs GS832236AB-300
GS8322ZV36B-133 ZBT SRAM, 1MX36, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 PITCH, FPBGA-119 GSI Technology K7N323601M-HC160 vs GS8322ZV36B-133
GS832436GB-150T Cache SRAM, 1MX36, 10ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, BGA-119 GSI Technology K7N323601M-HC160 vs GS832436GB-150T

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