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Overview of K7N323601M-FC150 by Samsung Semiconductor
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- Distributor Offerings: ( 0 listings )
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- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for K7N323601M-FC150 by Samsung Semiconductor
Part Data Attributes for K7N323601M-FC150 by Samsung Semiconductor
|
|
---|---|
Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
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Part Package Code
|
BGA
|
Package Description
|
LBGA,
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Pin Count
|
165
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
3A991.B.2.A
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HTS Code
|
8542.32.00.41
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Access Time-Max
|
3.8 ns
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Additional Feature
|
PIPELINED ARCHITECTURE
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JESD-30 Code
|
R-PBGA-B165
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Length
|
17 mm
|
Memory Density
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37748736 bit
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Memory IC Type
|
ZBT SRAM
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Memory Width
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36
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Number of Functions
|
1
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Number of Terminals
|
165
|
Number of Words
|
1048576 words
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Number of Words Code
|
1000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
|
|
Organization
|
1MX36
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LBGA
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
|
PARALLEL
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Qualification Status
|
Not Qualified
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Seated Height-Max
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1.4 mm
|
Supply Voltage-Max (Vsup)
|
3.465 V
|
Supply Voltage-Min (Vsup)
|
3.135 V
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Supply Voltage-Nom (Vsup)
|
3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
|
COMMERCIAL
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Terminal Form
|
BALL
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Terminal Pitch
|
1 mm
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Terminal Position
|
BOTTOM
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Width
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15 mm
|