Part Details for K7I643682M-FI300 by Samsung Semiconductor
Overview of K7I643682M-FI300 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Part Details for K7I643682M-FI300
K7I643682M-FI300 CAD Models
K7I643682M-FI300 Part Data Attributes
|
|
K7I643682M-FI300
Samsung Semiconductor
Buy Now
Datasheet
|
Compare Parts:
K7I643682M-FI300
Samsung Semiconductor
DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 300 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Voltage-Min | 1.7 V | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for K7I643682M-FI300
This table gives cross-reference parts and alternative options found for K7I643682M-FI300. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7I643682M-FI300, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| K7I643682M-EI30 | Samsung Semiconductor | Check for Price | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | K7I643682M-FI300 vs K7I643682M-EI30 |
| CY7C1520KV18-300BZI | Cypress Semiconductor | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | K7I643682M-FI300 vs CY7C1520KV18-300BZI |
| GS8662T36BD-300IT | GSI Technology | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | K7I643682M-FI300 vs GS8662T36BD-300IT |
| GS8672T36BE-300IT | GSI Technology | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | K7I643682M-FI300 vs GS8672T36BE-300IT |
| CY7C1520JV18-300BZXI | Cypress Semiconductor | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | K7I643682M-FI300 vs CY7C1520JV18-300BZXI |
| GS8662R36BD-300IT | GSI Technology | Check for Price | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | K7I643682M-FI300 vs GS8662R36BD-300IT |
| GS8662R36BGD-300IT | GSI Technology | Check for Price | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | K7I643682M-FI300 vs GS8662R36BGD-300IT |
| GS8662R36BGD-300I | GSI Technology | Check for Price | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | K7I643682M-FI300 vs GS8662R36BGD-300I |
| CY7C1570V18-300BZXI | Cypress Semiconductor | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | K7I643682M-FI300 vs CY7C1570V18-300BZXI |
| GS8672T36BE-300I | GSI Technology | Check for Price | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | K7I643682M-FI300 vs GS8672T36BE-300I |