Part Details for K7D161871B-HC370 by Samsung Semiconductor
Overview of K7D161871B-HC370 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
Part Details for K7D161871B-HC370
K7D161871B-HC370 CAD Models
K7D161871B-HC370 Part Data Attributes
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K7D161871B-HC370
Samsung Semiconductor
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Datasheet
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K7D161871B-HC370
Samsung Semiconductor
DDR SRAM, 1MX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | BGA, BGA153,9X17,50 | |
Pin Count | 153 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.2 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 375 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B153 | |
Length | 22 mm | |
Memory Density | 18874368 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 153 | |
Number of Words | 1048576 words | |
Number of Words Code | 1000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 1MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA153,9X17,50 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.21 mm | |
Standby Current-Max | 0.1 A | |
Standby Voltage-Min | 2.37 V | |
Supply Current-Max | 0.45 mA | |
Supply Voltage-Max (Vsup) | 2.63 V | |
Supply Voltage-Min (Vsup) | 2.37 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |
Alternate Parts for K7D161871B-HC370
This table gives cross-reference parts and alternative options found for K7D161871B-HC370. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7D161871B-HC370, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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K7D161871B-HC37 | Standard SRAM, 1MX18, 1.7ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Samsung Semiconductor | K7D161871B-HC370 vs K7D161871B-HC37 |