Part Details for K6L1008V2C-TB70T by Samsung Semiconductor
Overview of K6L1008V2C-TB70T by Samsung Semiconductor
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Applications
Computing and Data Storage
Part Details for K6L1008V2C-TB70T
K6L1008V2C-TB70T CAD Models
K6L1008V2C-TB70T Part Data Attributes
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K6L1008V2C-TB70T
Samsung Semiconductor
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Datasheet
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K6L1008V2C-TB70T
Samsung Semiconductor
Standard SRAM, 128KX8, 70ns, CMOS, PDSO32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Package Description | TSSOP, TSSOP32,.8,20 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e0 | |
| Memory Density | 1048576 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP32,.8,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL |