There are no models available for this part yet.
Overview of K4T1G084QQ-HCE60 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for K4T1G084QQ-HCE60 by Samsung Semiconductor
Part Data Attributes for K4T1G084QQ-HCE60 by Samsung Semiconductor
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code
|
BGA
|
Package Description
|
TFBGA, BGA60,9X11,32
|
Pin Count
|
60
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.32
|
Access Mode
|
MULTI BANK PAGE BURST
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK)
|
333 MHz
|
I/O Type
|
COMMON
|
Interleaved Burst Length
|
4,8
|
JESD-30 Code
|
R-PBGA-B60
|
Length
|
11 mm
|
Memory Density
|
1073741824 bit
|
Memory IC Type
|
DDR2 DRAM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
60
|
Number of Words
|
134217728 words
|
Number of Words Code
|
128000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
95 °C
|
Operating Temperature-Min
|
|
Organization
|
128MX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TFBGA
|
Package Equivalence Code
|
BGA60,9X11,32
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
Qualification Status
|
Not Qualified
|
Refresh Cycles
|
8192
|
Seated Height-Max
|
1.2 mm
|
Self Refresh
|
YES
|
Sequential Burst Length
|
4,8
|
Supply Current-Max
|
0.23 mA
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
OTHER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
0.8 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
Width
|
9 mm
|
Alternate Parts for K4T1G084QQ-HCE60
This table gives cross-reference parts and alternative options found for K4T1G084QQ-HCE60. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4T1G084QQ-HCE60, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
HYB18T1G800C2F-3S | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 | Qimonda AG | K4T1G084QQ-HCE60 vs HYB18T1G800C2F-3S |
MT47H128M8HV-3E:E | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 | Micron Technology Inc | K4T1G084QQ-HCE60 vs MT47H128M8HV-3E:E |
HYI18T1G800C2C-3S | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, PLASTIC, TFBGA-60 | Qimonda AG | K4T1G084QQ-HCE60 vs HYI18T1G800C2C-3S |
IS43DR81280A-3DBL-TR | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 13.65 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-60 | Integrated Silicon Solution Inc | K4T1G084QQ-HCE60 vs IS43DR81280A-3DBL-TR |
MT47H128M8HV-3IT:G | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 | Micron Technology Inc | K4T1G084QQ-HCE60 vs MT47H128M8HV-3IT:G |
MT47H128M8HV-3LAT:E | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 | Micron Technology Inc | K4T1G084QQ-HCE60 vs MT47H128M8HV-3LAT:E |
MT47H128M8JN-3L:H | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 10 MM, FBGA-60 | Micron Technology Inc | K4T1G084QQ-HCE60 vs MT47H128M8JN-3L:H |
HYB18T1G800C4F-3 | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 | Qimonda AG | K4T1G084QQ-HCE60 vs HYB18T1G800C4F-3 |
MT47H128M8HV-3E:G | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 | Micron Technology Inc | K4T1G084QQ-HCE60 vs MT47H128M8HV-3E:G |
MT47H128M8HV-3AT:E | DDR DRAM, 128MX8, 0.45ns, CMOS, PBGA60, 8 X 11.50 MM, FBGA-60 | Micron Technology Inc | K4T1G084QQ-HCE60 vs MT47H128M8HV-3AT:E |