Part Details for K4H560838F-ULA2 by Samsung Semiconductor
Overview of K4H560838F-ULA2 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Part Details for K4H560838F-ULA2
K4H560838F-ULA2 CAD Models
K4H560838F-ULA2 Part Data Attributes
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K4H560838F-ULA2
Samsung Semiconductor
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Datasheet
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K4H560838F-ULA2
Samsung Semiconductor
DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Package Description | TSSOP, TSSOP66,.46 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Access Time-Max | 0.75 ns | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 2,4,8 | |
| JESD-30 Code | R-PDSO-G66 | |
| Memory Density | 268435456 bit | |
| Memory IC Type | DDR1 DRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 66 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP66,.46 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Sequential Burst Length | 2,4,8 | |
| Standby Current-Max | 0.003 A | |
| Supply Current-Max | 0.25 mA | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Alternate Parts for K4H560838F-ULA2
This table gives cross-reference parts and alternative options found for K4H560838F-ULA2. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4H560838F-ULA2, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| K4H560838F-TLA2 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838F-TLA2 |
| K4H560838F-UCA2 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838F-UCA2 |
| K4H560838F-TCB0 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838F-TCB0 |
| K4H560838E-UCB0T | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838E-UCB0T |
| K4H560838E-ULA2T | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838E-ULA2T |
| K4H560838E-UCA2 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838E-UCA2 |
| K4H560838F-ULB0 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838F-ULB0 |
| K4H560838E-ULA2 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838E-ULA2 |
| K4H560838E-ULB00 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838E-ULB00 |
| K4H560838F-TLB0 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66 | Samsung Semiconductor | K4H560838F-ULA2 vs K4H560838F-TLB0 |