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Memory DRAMs K4H560838F-TCC40

Memory
K4H560838F-TCC40
Samsung Semiconductor
Description: DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66

Overview of K4H560838F-TCC40 by Samsung Semiconductor

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Where used in Applications: Consumer Electronics Computing and Data Storage

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Part Data Attributes for K4H560838F-TCC40 by Samsung Semiconductor
Parametric Data

K4H560838F-TCC40
Samsung Semiconductor
Buy Now
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
Package Description
TSOP2,
Pin Count
66
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.65 ns
Additional Feature
AUTO/SELF REFRESH
JESD-30 Code
R-PDSO-G66
JESD-609 Code
e0
Length
22.22 mm
Memory Density
268435456 bit
Memory IC Type
DDR1 DRAM
Memory Width
8
Number of Functions
1
Number of Ports
1
Number of Terminals
66
Number of Words
33554432 words
Number of Words Code
32000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32MX8
Package Body Material
PLASTIC/EPOXY
Package Code
TSOP2
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Self Refresh
YES
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.5 V
Supply Voltage-Nom (Vsup)
2.6 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
DUAL
Width
10.16 mm
Want to compare parts?
  1. K4H560838F-TCC40
    Samsung Semiconductor
    DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66
    VS

Alternate Parts for K4H560838F-TCC40

This table gives cross-reference parts and alternative options found for K4H560838F-TCC40. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4H560838F-TCC40, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
V58C2256804SALI-5 DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, GREEN, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SALI-5
V58C2256804SAT-5 DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SAT-5
K4H560838D-TCC40 DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor K4H560838F-TCC40 vs K4H560838D-TCC40
V58C2256804SCLE5BI DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SCLE5BI
V58C2256804SCI5BI DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, GREEN, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SCI5BI
V58C2256804SAT-5B DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SAT-5B
V58C2256804SALI-5B DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, GREEN, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SALI-5B
V58C2256804SALD-5B DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, DIE-STACKED, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SALD-5B
K4H560838E-TCC40 DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 Samsung Semiconductor K4H560838F-TCC40 vs K4H560838E-TCC40
V58C2256804SCE5BI DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SCE5BI
Part Number Description Manufacturer Compare
V58C2256804SCLJ5B DDR DRAM, 32MX8, 0.65ns, CMOS, PBGA60, GREEN, MO-233, FBGA-60 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SCLJ5B
V58C2256804SCE5D DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SCE5D
V58C2256804SAZ-5 DDR DRAM, 32MX8, 0.65ns, CMOS, PBGA60, M0-233, DIE-STACKED, FBGA-60 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SAZ-5
V58C2256804SAD-5B DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, DIE-STACKED, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SAD-5B
HY5DU56822FLTP-D5I DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 SK Hynix Inc K4H560838F-TCC40 vs HY5DU56822FLTP-D5I
V58C2256804SCJ5D DDR DRAM, 32MX8, 0.65ns, CMOS, PBGA60, GREEN, MO-233, FBGA-60 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SCJ5D
K4H560838J-HCCC0 DDR DRAM, 32MX8, 0.65ns, CMOS, PBGA60, ROHS COMPLIANT AND HALOGEN FREE, FBGA-60 Samsung Semiconductor K4H560838F-TCC40 vs K4H560838J-HCCC0
V58C2256804SAT-5 DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SAT-5
V58C2256804SBS5B DDR DRAM, 32MX8, 0.65ns, CMOS, PBGA60, MO-233, FBGA-60 ProMOS Technologies Inc K4H560838F-TCC40 vs V58C2256804SBS5B
K4H560838H-UCCC0 DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, ROHS COMPLIANT, TSOP2-66 Samsung Semiconductor K4H560838F-TCC40 vs K4H560838H-UCCC0

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