Part Details for K4H560838D-GCB30 by Samsung Semiconductor
Overview of K4H560838D-GCB30 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Part Details for K4H560838D-GCB30
K4H560838D-GCB30 CAD Models
K4H560838D-GCB30 Part Data Attributes
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K4H560838D-GCB30
Samsung Semiconductor
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Datasheet
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K4H560838D-GCB30
Samsung Semiconductor
DDR DRAM, 32MX8, 0.7ns, CMOS, PBGA60, FBGA-60
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | TBGA, | |
| Pin Count | 60 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.7 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B60 | |
| Length | 14 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |
Alternate Parts for K4H560838D-GCB30
This table gives cross-reference parts and alternative options found for K4H560838D-GCB30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4H560838D-GCB30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MT46V32M8BG-6ITH | DDR DRAM, 32MX8, 0.7ns, CMOS, PBGA60, 14 X 8 MM, PLASTIC, FBGA-60 | Micron Technology Inc | K4H560838D-GCB30 vs MT46V32M8BG-6ITH |
| MT46V32M8BG-6LH | DDR DRAM, 32MX8, 0.7ns, CMOS, PBGA60, 14 X 8 MM, PLASTIC, FBGA-60 | Micron Technology Inc | K4H560838D-GCB30 vs MT46V32M8BG-6LH |
| K4H560838D-GLB30 | DDR DRAM, 32MX8, 0.7ns, CMOS, PBGA60, FBGA-60 | Samsung Semiconductor | K4H560838D-GCB30 vs K4H560838D-GLB30 |
| MT46V32M8BG-6H | DDR DRAM, 32MX8, 0.7ns, CMOS, PBGA60, 14 X 8 MM, PLASTIC, FBGA-60 | Micron Technology Inc | K4H560838D-GCB30 vs MT46V32M8BG-6H |
| K4H560838D-ZCB30 | DDR DRAM, 32MX8, 0.7ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 | Samsung Semiconductor | K4H560838D-GCB30 vs K4H560838D-ZCB30 |