Datasheets
K4H510838G-HLB30 by: Samsung Semiconductor

DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60

Part Details for K4H510838G-HLB30 by Samsung Semiconductor

Overview of K4H510838G-HLB30 by Samsung Semiconductor

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Applications Consumer Electronics Computing and Data Storage Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Entertainment and Gaming

Part Details for K4H510838G-HLB30

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K4H510838G-HLB30 Part Data Attributes

K4H510838G-HLB30 Samsung Semiconductor
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K4H510838G-HLB30 Samsung Semiconductor DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Package Description BGA, BGA60,9X12,40/32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Time-Max 0.7 ns
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PBGA-B60
JESD-609 Code e3
Memory Density 536870912 bit
Memory IC Type DDR1 DRAM
Memory Width 8
Moisture Sensitivity Level 1
Number of Terminals 60
Number of Words 67108864 words
Number of Words Code 64000000
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA60,9X12,40/32
Package Shape RECTANGULAR
Package Style GRID ARRAY
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 2,4,8
Standby Current-Max 0.005 A
Supply Current-Max 0.22 mA
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM

Alternate Parts for K4H510838G-HLB30

This table gives cross-reference parts and alternative options found for K4H510838G-HLB30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4H510838G-HLB30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K4H510838G-HLB3T DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60 Samsung Semiconductor K4H510838G-HLB30 vs K4H510838G-HLB3T
MT46V64M8FN-6L:F DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc K4H510838G-HLB30 vs MT46V64M8FN-6L:F
MT46V64M8BN-6L:F DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, PLASTIC, FBGA-60 Micron Technology Inc K4H510838G-HLB30 vs MT46V64M8BN-6L:F
MT46V64M8BN-6:D DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, PLASTIC, FBGA-60 Micron Technology Inc K4H510838G-HLB30 vs MT46V64M8BN-6:D
MT46V64M8FN-6:F DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc K4H510838G-HLB30 vs MT46V64M8FN-6:F
MT46V64M8BN-6L:D DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, PLASTIC, FBGA-60 Micron Technology Inc K4H510838G-HLB30 vs MT46V64M8BN-6L:D
K4H510838F-HLB3 DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, Samsung Semiconductor K4H510838G-HLB30 vs K4H510838F-HLB3
K4H510838J-BCB30 DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, HALOGEN FREE AND ROHS COMPLIANT, FBGA-60 Samsung Semiconductor K4H510838G-HLB30 vs K4H510838J-BCB30
K4H510838D-ZCB3 DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, Samsung Semiconductor K4H510838G-HLB30 vs K4H510838D-ZCB3
K4H510838G-HLB3 DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60 Samsung Semiconductor K4H510838G-HLB30 vs K4H510838G-HLB3
Part Number Description Manufacturer Compare
K4H510838B-GLA20 DDR DRAM, 64MX8, 0.75ns, CMOS, PBGA60, FBGA-60 Samsung Semiconductor K4H510838G-HLB30 vs K4H510838B-GLA20
MT46V32M8FG-75ELAT:G DDR DRAM, 64MX8, 0.75ns, CMOS, PBGA60, (8 X 14) MM, PLASTIC, FBGA-60 Micron Technology Inc K4H510838G-HLB30 vs MT46V32M8FG-75ELAT:G
HYB18T512800B2FL-3.7 DDR DRAM, 64MX8, 0.5ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 Qimonda AG K4H510838G-HLB30 vs HYB18T512800B2FL-3.7
HY5DU12822CLFP-H DDR DRAM, 64MX8, 0.75ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc K4H510838G-HLB30 vs HY5DU12822CLFP-H
MT46V64M8FN-6LIT:D DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc K4H510838G-HLB30 vs MT46V64M8FN-6LIT:D
H5PS5182FFP-S5C DDR DRAM, 64MX8, 0.4ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc K4H510838G-HLB30 vs H5PS5182FFP-S5C
V58C2512804SDLJ7 DDR DRAM, 64MX8, CMOS, PBGA60, GREEN, MO-207, FBGA-60 ProMOS Technologies Inc K4H510838G-HLB30 vs V58C2512804SDLJ7
HY5DU12822BF-D43 DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, FBGA-60 SK Hynix Inc K4H510838G-HLB30 vs HY5DU12822BF-D43
IS43DR86400-3DBL DDR DRAM, 64MX8, CMOS, PBGA60, 10 X 10.50 MM, 0.80 MM PITCH, LEAD FREE, MO-207, FBGA-60 Integrated Silicon Solution Inc K4H510838G-HLB30 vs IS43DR86400-3DBL
V59C1512804QCF37 64MX8 DDR DRAM, 0.5ns, PBGA60, ROHS COMPLIANT, MO-207, FBGA-60 ProMOS Technologies Inc K4H510838G-HLB30 vs V59C1512804QCF37

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