Part Details for K4E661612E-TC60 by Samsung Semiconductor
Overview of K4E661612E-TC60 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LTC6090HS8E-5#TRPBF | Analog Devices | 140V CMOS R2R Out, pA In C Op | |
LTC6090IFE-5#TRPBF | Analog Devices | 140V CMOS R2R Out, pA In C Op | |
LTC6078CDD#PBF | Analog Devices | uP Prec, 2x CMOS R2R In/Out Am |
Part Details for K4E661612E-TC60
K4E661612E-TC60 CAD Models
K4E661612E-TC60 Part Data Attributes
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K4E661612E-TC60
Samsung Semiconductor
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Datasheet
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K4E661612E-TC60
Samsung Semiconductor
EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
Part Package Code | TSOP2 | |
Package Description | TSOP2, TSOP50,.46,32 | |
Pin Count | 50 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.02 | |
Access Mode | FAST PAGE WITH EDO | |
Access Time-Max | 60 ns | |
Additional Feature | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | |
I/O Type | COMMON | |
JESD-30 Code | R-PDSO-G50 | |
JESD-609 Code | e0 | |
Length | 20.95 mm | |
Memory Density | 67108864 bit | |
Memory IC Type | EDO DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 50 | |
Number of Words | 4194304 words | |
Number of Words Code | 4000000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 4MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSOP2 | |
Package Equivalence Code | TSOP50,.46,32 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | NO | |
Standby Current-Max | 0.0005 A | |
Supply Current-Max | 0.11 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.8 mm | |
Terminal Position | DUAL | |
Width | 10.16 mm |
Alternate Parts for K4E661612E-TC60
This table gives cross-reference parts and alternative options found for K4E661612E-TC60. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4E661612E-TC60, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
HYB3166165BT-60 | EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | Infineon Technologies AG | K4E661612E-TC60 vs HYB3166165BT-60 |
TC5164165AFT-60 | IC 4M X 16 EDO DRAM, 60 ns, PDSO50, 0.400 INCH, PLASTIC, TSOP-50, Dynamic RAM | Toshiba America Electronic Components | K4E661612E-TC60 vs TC5164165AFT-60 |
KM416V4104CT-6 | EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | Samsung Semiconductor | K4E661612E-TC60 vs KM416V4104CT-6 |
HYB3166165BTL-60 | EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | Siemens | K4E661612E-TC60 vs HYB3166165BTL-60 |
HYB3166165BT-60 | EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | Siemens | K4E661612E-TC60 vs HYB3166165BT-60 |
KM416V4004CS-L6 | EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | Samsung Semiconductor | K4E661612E-TC60 vs KM416V4004CS-L6 |
TMS465169-60DGE | 4MX16 EDO DRAM, 60ns, PDSO50, 0.400 INCH, PLASTIC, TSOP-50 | Texas Instruments | K4E661612E-TC60 vs TMS465169-60DGE |
GM71VS65163CLT-6 | EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | SK Hynix Inc | K4E661612E-TC60 vs GM71VS65163CLT-6 |
HY51V64164LTC-60 | EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP2-50 | SK Hynix Inc | K4E661612E-TC60 vs HY51V64164LTC-60 |
MT4LC4M16U2TG-60TR | EDO DRAM, 4MX16, 60ns, CMOS, PDSO50, 0.400 INCH, PLASTIC, TSOP-50 | Micron Technology Inc | K4E661612E-TC60 vs MT4LC4M16U2TG-60TR |