Part Details for K4C89093AF-GCF50 by Samsung Semiconductor
Overview of K4C89093AF-GCF50 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Part Details for K4C89093AF-GCF50
K4C89093AF-GCF50 CAD Models
K4C89093AF-GCF50 Part Data Attributes
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K4C89093AF-GCF50
Samsung Semiconductor
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Datasheet
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K4C89093AF-GCF50
Samsung Semiconductor
DDR DRAM, 32MX9, 0.6ns, CMOS, PBGA144, 1 X 1 MM PITCH, FBGA-144
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | TBGA, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.28 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.6 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B144 | |
| JESD-609 Code | e0 | |
| Length | 15.5 mm | |
| Memory Density | 301989888 bit | |
| Memory IC Type | DDR1 DRAM | |
| Memory Width | 9 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 144 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX9 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |
Alternate Parts for K4C89093AF-GCF50
This table gives cross-reference parts and alternative options found for K4C89093AF-GCF50. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K4C89093AF-GCF50, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS49NLS93200-25BL | DDR DRAM, 32MX9, 2.5ns, CMOS, PBGA144, 11 X 18.50 MM, LEAD FREE, FBGA-144 | Integrated Silicon Solution Inc | K4C89093AF-GCF50 vs IS49NLS93200-25BL |
| MT49H32M9CFM-5IT | DDR DRAM, 32MX9, 0.5ns, CMOS, PBGA144, MICRO, BGA-144 | Micron Technology Inc | K4C89093AF-GCF50 vs MT49H32M9CFM-5IT |
| IS49NLS93200-33BLI | DDR DRAM, 32MX9, 3.3ns, CMOS, PBGA144, 11 X 18.50 MM, LEAD FREE, FBGA-144 | Integrated Silicon Solution Inc | K4C89093AF-GCF50 vs IS49NLS93200-33BLI |
| MT49H32M9BM-3.3 | DDR DRAM, 32MX9, CMOS, PBGA144, 11 X 18.50 MM, LEAD FREE, MICRO, BGA-144 | Micron Technology Inc | K4C89093AF-GCF50 vs MT49H32M9BM-3.3 |
| HYB18RL28809AC-2.5 | DDR DRAM, 32MX9, CMOS, PBGA144, PLASTIC, TFBGA-144 | Infineon Technologies AG | K4C89093AF-GCF50 vs HYB18RL28809AC-2.5 |
| GS4288C09GL-33IT | DDR DRAM, 32MX9, CMOS, PBGA144, ROHS COMPLIANT, UBGA-144 | GSI Technology | K4C89093AF-GCF50 vs GS4288C09GL-33IT |
| MT49H32M9CHU-25 | DDR DRAM, 32MX9, 0.25ns, CMOS, PBGA144, FBGA-144 | Micron Technology Inc | K4C89093AF-GCF50 vs MT49H32M9CHU-25 |
| GS4288S09L-33IT | DDR DRAM, 32MX9, CMOS, PBGA144, UBGA-144 | GSI Technology | K4C89093AF-GCF50 vs GS4288S09L-33IT |
| IS49NLS93200-18BI | DDR DRAM, 32MX9, 1.875ns, CMOS, PBGA144, 11 X 18.50 MM, FBGA-144 | Integrated Silicon Solution Inc | K4C89093AF-GCF50 vs IS49NLS93200-18BI |
| MT49H32M9CFM-33IT | DDR DRAM, 32MX9, 0.3ns, CMOS, PBGA144, MICRO, BGA-144 | Micron Technology Inc | K4C89093AF-GCF50 vs MT49H32M9CFM-33IT |