Datasheets
JM38510/29310BLC by: Micross Components

Standard SRAM, 256KX1, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24

Part Details for JM38510/29310BLC by Micross Components

Overview of JM38510/29310BLC by Micross Components

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Part Details for JM38510/29310BLC

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JM38510/29310BLC Part Data Attributes

JM38510/29310BLC Micross Components
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JM38510/29310BLC Micross Components Standard SRAM, 256KX1, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROSS COMPONENTS
Part Package Code DIP
Package Description DIP,
Pin Count 24
Reach Compliance Code compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Access Time-Max 25 ns
JESD-30 Code R-CDIP-T24
JESD-609 Code e4
Length 30.48 mm
Memory Density 262144 bit
Memory IC Type STANDARD SRAM
Memory Width 1
Number of Functions 1
Number of Terminals 24
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 256KX1
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial SERIAL
Qualification Status Not Qualified
Seated Height-Max 3.81 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish PALLADIUM GOLD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for JM38510/29310BLC

This table gives cross-reference parts and alternative options found for JM38510/29310BLC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of JM38510/29310BLC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
JM38510/29310BLA Standard SRAM, 256KX1, 25ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Micross Components JM38510/29310BLC vs JM38510/29310BLA
Part Number Description Manufacturer Compare
MSM1256TI-25 Standard SRAM, 256KX1, 25ns, BICMOS, CDIP24 Mosaic Semiconductor Inc JM38510/29310BLC vs MSM1256TI-25
HX6156NEHC Standard SRAM, 256KX1, 25ns, CMOS, CDFP28, 0.500 X 0.720 INCH, CERAMIC, FP-28 Honeywell Microelectronics & Precision Sensors JM38510/29310BLC vs HX6156NEHC
HM3-65797H-5 Standard SRAM, 256KX1, 25ns, CMOS, PDIP24 Matra MHS JM38510/29310BLC vs HM3-65797H-5
MS62251A-25NC Standard SRAM, 256KX1, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 Mosel Vitelic Corporation JM38510/29310BLC vs MS62251A-25NC
HX6156NEFC IC 256K X 1 STANDARD SRAM, 25 ns, CDFP28, 0.500 X 0.720 INCH, CERAMIC, FP-28, Static RAM Honeywell Sensing and Control JM38510/29310BLC vs HX6156NEFC
EDI81257CB25FB Standard SRAM, 256KX1, 25ns, CMOS, CDFP28, Electronic Designs Inc JM38510/29310BLC vs EDI81257CB25FB
HX6156NVFC IC 256K X 1 STANDARD SRAM, 25 ns, CDFP28, 0.500 X 0.720 INCH, CERAMIC, FP-28, Static RAM Honeywell Sensing and Control JM38510/29310BLC vs HX6156NVFC
HX6856/1N4N-T IC 256K X 1 STANDARD SRAM, 25 ns, CDFP28, 0.530 X 0.720 INCH, CERAMIC, FP-28, Static RAM Honeywell Sensing and Control JM38510/29310BLC vs HX6856/1N4N-T
HMU-65797H-5 Standard SRAM, 256KX1, 25ns, CMOS, PDSO24 Matra MHS JM38510/29310BLC vs HMU-65797H-5
HX6156NEFT Standard SRAM, 256KX1, 25ns, CMOS, CDFP28, 0.500 X 0.720 INCH, CERAMIC, FP-28 Honeywell Microelectronics & Precision Sensors JM38510/29310BLC vs HX6156NEFT

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