| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
65AC6049
|
Newark | Psram, 8Mbit, 70Ns, Mini Bga-48, Memory Size:8Mbit, Sram Memory Configuration:512K X 16Bit, Supply Voltage Range:2.5V To 3.6V, Memory Case Style:Mini Bga, No. Of Pins:48Pins, Access Time:70Ns, Operating Temperature Min:-40°C, Rohs Compliant: Yes |Integrated Silicon Solution (Issi) IS66WV51216EBLL-70BLI RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 22 |
|
$2.5700 / $3.3800 | Buy Now | |
|
DISTI #
IS66WV51216EBLL-70BLI-ND
|
DigiKey | IC PSRAM 8MBIT PARALLEL 48TFBGA Min Qty: 480 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
|
$2.5509 | Buy Now | |
|
DISTI #
IS66WV51216EBLL-70
|
Avnet Americas | SRAM Chip Async Single 3.3V 8M-Bit 512K x 16 70ns 48-Pin Mini-BGA - Bulk (Alt: IS66WV51216EBLL-70) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Lead time: 10 Weeks, 0 Days Container: Bulk | 0 |
|
$1.8400 | Buy Now | |
|
DISTI #
870-6651216EBLL70BLI
|
Mouser Electronics | SRAM 8Mb,Pseudo SRAM,Async,512K x 16,70ns,2.5v-3.6v,48 Ball BGA (6x8mm), RoHS RoHS: Compliant | 635 |
|
$2.2300 / $3.2500 | Buy Now | |
|
DISTI #
IS66WV51216EBLL-70BLI
|
Avnet Silica | SRAM Chip Async Single 3.3V 8M-Bit 512K x 16 70ns 48-Pin Mini-BGA (Alt: IS66WV51216EBLL-70BLI) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 14 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
|
|
Package Description
|
TFBGA,
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Factory Lead Time
|
10 Weeks
|
|
Samacsys Manufacturer
|
Integrated Silicon Solution Inc.
|
|
Access Time-Max
|
70 ns
|
|
JESD-30 Code
|
R-PBGA-B48
|
|
Length
|
8 mm
|
|
Memory Density
|
8388608 bit
|
|
Memory IC Type
|
PSEUDO STATIC RAM
|
|
Memory Width
|
16
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
48
|
|
Number of Words
|
524288 words
|
|
Number of Words Code
|
512000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
512KX16
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TFBGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
NOT SPECIFIED
|
|
Seated Height-Max
|
1.2 mm
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.5 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.75 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
NOT SPECIFIED
|
|
Width
|
6 mm
|
