Datasheets
IS61C1024-12MR by: Integrated Silicon Solution Inc

Standard SRAM, 128KX8, 12ns, CMOS, PDIP32, 0.400 INCH, PLASTIC, DIP-32

Part Details for IS61C1024-12MR by Integrated Silicon Solution Inc

Overview of IS61C1024-12MR by Integrated Silicon Solution Inc

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Part Details for IS61C1024-12MR

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IS61C1024-12MR Part Data Attributes

IS61C1024-12MR Integrated Silicon Solution Inc
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IS61C1024-12MR Integrated Silicon Solution Inc Standard SRAM, 128KX8, 12ns, CMOS, PDIP32, 0.400 INCH, PLASTIC, DIP-32
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Part Package Code DIP
Package Description 0.400 INCH, PLASTIC, DIP-32
Pin Count 32
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Category CO2 Kg 12
Compliance Temperature Grade Commercial: +0C to +70C
Access Time-Max 12 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T32
JESD-609 Code e0
Length 40.259 mm
Memory Density 1048576 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 128KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP32,.4
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.22 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for IS61C1024-12MR

This table gives cross-reference parts and alternative options found for IS61C1024-12MR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61C1024-12MR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
PDM41034SA12TSOITY Standard SRAM, 128KX8, 12ns, CMOS, PDSO32 Paradigm Technology Inc IS61C1024-12MR vs PDM41034SA12TSOITY
KM681002CT-12000 Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32 Samsung Semiconductor IS61C1024-12MR vs KM681002CT-12000
PDM41024S12TSOTY Standard SRAM, 128KX8, 12ns, CMOS, PDSO32 Paradigm Technology Inc IS61C1024-12MR vs PDM41024S12TSOTY
L7C108YMB12 Standard SRAM, 128KX8, 12ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32 LOGIC Devices Inc IS61C1024-12MR vs L7C108YMB12
W24010ACK-12 Standard SRAM, 128KX8, 12ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 Winbond Electronics Corp IS61C1024-12MR vs W24010ACK-12
IS61C1024L-12MR Standard SRAM, 128KX8, 12ns, CMOS, PDIP32, 0.400 INCH, PLASTIC, DIP-32 Integrated Silicon Solution Inc IS61C1024-12MR vs IS61C1024L-12MR
AS7C1024L-12TC Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 8 X 20 MM, TSOP-32 Alliance Semiconductor Corporation IS61C1024-12MR vs AS7C1024L-12TC
IS63C1024-12T Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP2-32 Integrated Silicon Solution Inc IS61C1024-12MR vs IS63C1024-12T
L7C108DMB12 Standard SRAM, 128KX8, 12ns, CMOS, CDIP32, 0.400 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-32 LOGIC Devices Inc IS61C1024-12MR vs L7C108DMB12
PDM41024LB12SOITY Standard SRAM, 128KX8, 12ns, CMOS, PDSO32 Paradigm Technology Inc IS61C1024-12MR vs PDM41024LB12SOITY

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