Part Details for IS46LQ16128AL-062BLA2 by Integrated Silicon Solution Inc
Overview of IS46LQ16128AL-062BLA2 by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for IS46LQ16128AL-062BLA2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
89AH8556
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Newark | Automotive (Tc: -40 To +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, Lpddr4X, 128Mx16, 1600Mhz, 200 Ball Bga (10Mm X 14.5Mm) Rohs |Integrated Silicon Solution (Issi) IS46LQ16128AL-062BLA2 RoHS: Not Compliant Min Qty: 136 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$11.9700 / $13.6100 | Buy Now |
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DISTI #
IS46LQ16128AL-062B
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Avnet Americas | DRAM Chip LPDDR4 SDRAM 2Gbit 128M X 16 1.1V/1.8V 200-Pin BGA - Trays (Alt: IS46LQ16128AL-062B) RoHS: Not Compliant Min Qty: 136 Package Multiple: 136 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
870-46L128A062BLA2
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Mouser Electronics | DRAM Automotive (Tc: -40 to +105C), 2G, 0.57-0.65V/1.06-1.17/1.70-1.95V, LPDDR4X, 128Mx16, 1600MHz, 200 ball BGA (10mmx14.5mm) RoHS RoHS: Compliant | 0 |
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$11.9900 / $12.6200 | Order Now |
Part Details for IS46LQ16128AL-062BLA2
IS46LQ16128AL-062BLA2 CAD Models
IS46LQ16128AL-062BLA2 Part Data Attributes
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IS46LQ16128AL-062BLA2
Integrated Silicon Solution Inc
Buy Now
Datasheet
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IS46LQ16128AL-062BLA2
Integrated Silicon Solution Inc
DRAM,
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | VFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 14 Weeks | |
| Access Mode | MULTI BANK PAGE BURST | |
| Clock Frequency-Max (fCLK) | 1600 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 16,32 | |
| JESD-30 Code | R-PBGA-B200 | |
| Length | 14.5 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | LPDDR4X DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 200 | |
| Number of Words | 134217728 words | |
| Number of Words Code | 128000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA200,12X22,32/25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 0.85 mm | |
| Self Refresh | NO | |
| Sequential Burst Length | 16,32 | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |