Part Details for IS46DR16640C-25DBLA2 by Integrated Silicon Solution Inc
Overview of IS46DR16640C-25DBLA2 by Integrated Silicon Solution Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for IS46DR16640C-25DBLA2
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
13AC5165
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Newark | Automotive (Tc: -40 To +105C),1G, 1.8V, Ddr2, 64Mx16, 400Mhz @ Cl5, 84 Ball Bga (8Mm X 12.5Mm) Rohs |Integrated Silicon Solution (Issi) IS46DR16640C-25DBLA2 RoHS: Not Compliant Min Qty: 209 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$5.1000 / $6.3000 | Buy Now |
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DISTI #
IS46DR16640C-25DBLA2-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 84TWBGA Min Qty: 209 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$5.9706 | Buy Now |
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DISTI #
IS46DR16640C-25DBL
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Avnet Americas | DRAM Chip DDR2 DRAM 1G-Bit 64Mx16 400MHz 1.8V -40 to +105?C AT 84-Ball BGA - Trays (Alt: IS46DR16640C-25DBL) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$5.4805 | Buy Now |
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DISTI #
870-4616640C25DBLA2
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Mouser Electronics | DRAM Automotive (Tc: -40 to +105C),1G, 18V, DDR2, 64Mx16, 400Mhz a. CL5, 84 ball BGA (8mmx125mm) RoHS RoHS: Compliant | 179 |
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$5.4400 / $7.3100 | Buy Now |
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DISTI #
IS46DR16640C-25DBLA2
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Avnet Silica | DRAM Chip DDR2 DRAM 1G-Bit 64Mx16 400MHz 1.8V -40 to +105�C AT 84-Ball BGA (Alt: IS46DR16640C-25DBLA2) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS46DR16640C-25DBLA2
IS46DR16640C-25DBLA2 CAD Models
IS46DR16640C-25DBLA2 Part Data Attributes
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IS46DR16640C-25DBLA2
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS46DR16640C-25DBLA2
Integrated Silicon Solution Inc
DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, WBGA-84
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.4 ns | |
| Additional Feature | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B84 | |
| JESD-609 Code | e1 | |
| Length | 12.5 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |