Part Details for IS43DR86400C-3DBLI-TR by Integrated Silicon Solution Inc
Overview of IS43DR86400C-3DBLI-TR by Integrated Silicon Solution Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Price & Stock for IS43DR86400C-3DBLI-TR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
29X5228
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Newark | 512M, 1.8V, Ddr2, 64Mx8, 333Mhz @ Cl5, 60 Ball Bga (8Mm X 10.5Mm) Rohs, It, T&r |Integrated Silicon Solution (Issi) IS43DR86400C-3DBLI-TR RoHS: Not Compliant Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$4.7000 | Buy Now |
DISTI #
IS43DR86400C-3DBLI-TR-ND
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DigiKey | IC DRAM 512MBIT PAR 60TWBGA Min Qty: 2000 Lead time: 8 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$5.4981 | Buy Now |
DISTI #
IS43DR86400C-3DBLI
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Avnet Americas | DRAMs Parts and Modules - Tape and Reel (Alt: IS43DR86400C-3DBLI) RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 3 Weeks, 0 Days Container: Reel | 0 |
|
$5.1701 | Buy Now |
DISTI #
870-43DR86400C3DBLIT
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Mouser Electronics | DRAM 512M, 1.8V, DDR2, 64Mx8, 333Mhz a. CL5, 60 ball BGA (8mmx10.5mm) RoHS, IT, T&R RoHS: Compliant | 0 |
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$5.3300 | Order Now |
DISTI #
IS43DR86400C-3DBLI-TR
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Avnet Asia | DRAMs Parts and Modules (Alt: IS43DR86400C-3DBLI-TR) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 8 Weeks, 0 Days | 0 |
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RFQ |
Part Details for IS43DR86400C-3DBLI-TR
IS43DR86400C-3DBLI-TR CAD Models
IS43DR86400C-3DBLI-TR Part Data Attributes
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IS43DR86400C-3DBLI-TR
Integrated Silicon Solution Inc
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Datasheet
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IS43DR86400C-3DBLI-TR
Integrated Silicon Solution Inc
IC SDRAM 512MBIT 333MHZ 60BGA
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | 8 X 10.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-60 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 8 Weeks | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 0.45 ns | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B60 | |
JESD-609 Code | e1 | |
Length | 10.5 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | DDR2 DRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 60 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 64MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Width | 8 mm |