Datasheets
IS42S83200B-6TLI by: Integrated Silicon Solution Inc

Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, LEAD FREE, PLASTIC, TSOP2-54

Part Details for IS42S83200B-6TLI by Integrated Silicon Solution Inc

Overview of IS42S83200B-6TLI by Integrated Silicon Solution Inc

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Applications Consumer Electronics Industrial Automation Renewable Energy Robotics and Drones

Part Details for IS42S83200B-6TLI

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IS42S83200B-6TLI Part Data Attributes

IS42S83200B-6TLI Integrated Silicon Solution Inc
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IS42S83200B-6TLI Integrated Silicon Solution Inc Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, LEAD FREE, PLASTIC, TSOP2-54
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Part Package Code TSOP2
Package Description TSOP2, TSOP54,.46,32
Pin Count 54
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.24
Samacsys Manufacturer Integrated Silicon Solution Inc.
Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.4 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 1,2,4,8
JESD-30 Code R-PDSO-G54
JESD-609 Code e3
Length 22.22 mm
Memory Density 268435456 bit
Memory IC Type SYNCHRONOUS DRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 54
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 32MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Equivalence Code TSOP54,.46,32
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.001 A
Supply Current-Max 0.18 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.8 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 10
Width 10.16 mm

Alternate Parts for IS42S83200B-6TLI

This table gives cross-reference parts and alternative options found for IS42S83200B-6TLI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS42S83200B-6TLI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HY57V56820AT-H Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 SK Hynix Inc IS42S83200B-6TLI vs HY57V56820AT-H
K4S560832C-TC750 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 Samsung Semiconductor IS42S83200B-6TLI vs K4S560832C-TC750
V54C3256804VHUI7I Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, GREEN, PLASTIC, TSOP2-54 ProMOS Technologies Inc IS42S83200B-6TLI vs V54C3256804VHUI7I
HYB39S256800FE-7 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, GREEN, PLASTIC, TSOP2-54 Infineon Technologies AG IS42S83200B-6TLI vs HYB39S256800FE-7
V54C3256804VGLI-6 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, GREEN, PLASTIC, TSSOP2-54 ProMOS Technologies Inc IS42S83200B-6TLI vs V54C3256804VGLI-6
TC59SM808BFT-70 IC 32M X 8 SYNCHRONOUS DRAM, 5.4 ns, PDSO54, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-54, Dynamic RAM Toshiba America Electronic Components IS42S83200B-6TLI vs TC59SM808BFT-70
K4S560832B-TC75 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 Samsung Semiconductor IS42S83200B-6TLI vs K4S560832B-TC75
HY57V56820FT-H Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.875 X 0.400 INCH, 0.80 MM PITCH, TSOP2-54 SK Hynix Inc IS42S83200B-6TLI vs HY57V56820FT-H
TC59SM808CFT-70 IC 32M X 8 SYNCHRONOUS DRAM, 5.4 ns, PDSO54, 0.400 INCH, 0.80 MM PITCH, PLASTIC, TSOP2-54, Dynamic RAM Toshiba America Electronic Components IS42S83200B-6TLI vs TC59SM808CFT-70
W982508BH-7 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54 Winbond Electronics Corp IS42S83200B-6TLI vs W982508BH-7
Part Number Description Manufacturer Compare
V54C3256804VDUT7PC Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 ProMOS Technologies Inc IS42S83200B-6TLI vs V54C3256804VDUT7PC
HYI39S256800FT-7 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 Qimonda AG IS42S83200B-6TLI vs HYI39S256800FT-7
V54C3256804VDLI7 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, GREEN, PLASTIC, TSOP2-54 ProMOS Technologies Inc IS42S83200B-6TLI vs V54C3256804VDLI7
W982508BH75I Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, 0.80 MM PITCH, TSOP2-54 Winbond Electronics Corp IS42S83200B-6TLI vs W982508BH75I
K4S560832E-TC75 Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, TSOP2-54 Samsung Semiconductor IS42S83200B-6TLI vs K4S560832E-TC75
V54C3256804VBUE7PC Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, LEAD FREE, PLASTIC, TSOP2-54 ProMOS Technologies Inc IS42S83200B-6TLI vs V54C3256804VBUE7PC
H57V2582GTR-60C Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, ROHS COMPLIANT, TSOP2-54 SK Hynix Inc IS42S83200B-6TLI vs H57V2582GTR-60C
MT48LC32M8A1TG-75:D Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP-54 Micron Technology Inc IS42S83200B-6TLI vs MT48LC32M8A1TG-75:D
HY57V56820AT-H Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, TSOP2-54 SK Hynix Inc IS42S83200B-6TLI vs HY57V56820AT-H
V54C3256804VDLT7PC Synchronous DRAM, 32MX8, 5.4ns, CMOS, PDSO54, 0.400 INCH, PLASTIC, TSOP2-54 ProMOS Technologies Inc IS42S83200B-6TLI vs V54C3256804VDLT7PC

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