Part Details for IS42S16100H-6BLI by Integrated Silicon Solution Inc
Overview of IS42S16100H-6BLI by Integrated Silicon Solution Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS42S16100H-6BLI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
81Y1199
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Newark | 16M, 3.3V, Sdram, 1Mx16, 166Mhz, 60 Ball Bga (6.4Mm X 10.1Mm) Rohs, It |Integrated Silicon Solution (Issi) IS42S16100H-6BLI Min Qty: 286 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$1.1500 / $1.1800 | Buy Now |
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DISTI #
IS42S16100H-6BLI-ND
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DigiKey | IC DRAM 16MBIT PARALLEL 60TFBGA Min Qty: 858 Lead time: 6 Weeks Container: Tray | Temporarily Out of Stock |
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$1.4950 | Buy Now |
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DISTI #
IS42S16100H-6BLI
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Avnet Americas | DRAM Chip SDRAM 16M-Bit 1Mx16 3.3V 60-Pin TFBGA - Trays (Alt: IS42S16100H-6BLI) RoHS: Not Compliant Min Qty: 858 Package Multiple: 286 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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$1.0750 / $1.3158 | Buy Now |
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DISTI #
870-IS42S16100H-6BLI
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Mouser Electronics | DRAM 16M, 3.3V, SDRAM 1Mx16, 166Mhz,RoHS RoHS: Compliant | 157 |
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$1.8400 / $2.6800 | Buy Now |
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DISTI #
IS42S16100H-6BLI
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Avnet Americas | DRAM Chip SDRAM 16M-Bit 1Mx16 3.3V 60-Pin TFBGA - Trays (Alt: IS42S16100H-6BLI) RoHS: Not Compliant Min Qty: 858 Package Multiple: 286 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$1.0750 / $1.3158 | Buy Now |
|
DISTI #
IS42S16100H-6BLI
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Avnet Asia | DRAM Chip SDRAM 16M-Bit 1Mx16 3.3V 60-Pin TFBGA (Alt: IS42S16100H-6BLI) RoHS: Compliant Min Qty: 1430 Package Multiple: 286 Lead time: 14 Weeks, 0 Days | 0 |
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RFQ |
Part Details for IS42S16100H-6BLI
IS42S16100H-6BLI CAD Models
IS42S16100H-6BLI Part Data Attributes:
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IS42S16100H-6BLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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IS42S16100H-6BLI
Integrated Silicon Solution Inc
Synchronous DRAM, 1MX16, 5.5ns, CMOS, PBGA60, TFBGA-60
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, BGA60,7X15,25 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.02 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | DUAL BANK PAGE BURST | |
| Access Time-Max | 5.5 ns | |
| Additional Feature | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 1,2,4,8 | |
| JESD-30 Code | R-PBGA-B60 | |
| Length | 10.1 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA60,7X15,25 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 2048 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 1,2,4,8,FP | |
| Standby Current-Max | 0.0035 A | |
| Supply Current-Max | 0.08 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Width | 6.4 mm |