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Overview of IS29GL256S90DHI023 by Integrated Silicon Solution Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
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- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for IS29GL256S90DHI023 by Integrated Silicon Solution Inc
Part Data Attributes for IS29GL256S90DHI023 by Integrated Silicon Solution Inc
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Part Life Cycle Code
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Active
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Ihs Manufacturer
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INTEGRATED SILICON SOLUTION INC
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Package Description
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LBGA,
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Reach Compliance Code
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unknown
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.51
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Access Time-Max
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90 ns
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Boot Block
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BOTTOM/TOP
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JESD-30 Code
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S-PBGA-B64
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Length
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9 mm
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Memory Density
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268435456 bit
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Memory IC Type
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FLASH
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Memory Width
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8
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Number of Functions
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1
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Number of Terminals
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64
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Number of Words
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33554432 words
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Number of Words Code
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32000000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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32MX8
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LBGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
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PARALLEL
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Peak Reflow Temperature (Cel)
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NOT SPECIFIED
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Programming Voltage
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3 V
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Seated Height-Max
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1.4 mm
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Supply Voltage-Max (Vsup)
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3.6 V
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Supply Voltage-Min (Vsup)
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2.7 V
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Supply Voltage-Nom (Vsup)
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3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Type
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NOR TYPE
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Width
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9 mm
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