| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
706-IS21ES64G-JQLI-ND
|
DigiKey | IC FLASH 512GBIT EMMC 100LFBGA Lead time: 18 Weeks Container: Tray | Limited Supply - Call |
|
Buy Now |
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
|
|
Package Description
|
LBGA, BGA100,12X17,40
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
|
|
Factory Lead Time
|
53 Weeks, 1 Day
|
|
Date Of Intro
|
2016-10-24
|
|
Samacsys Manufacturer
|
Integrated Silicon Solution Inc.
|
|
Alternate Memory Width
|
4
|
|
Clock Frequency-Max (fCLK)
|
200 MHz
|
|
Command User Interface
|
NO
|
|
Data Polling
|
NO
|
|
JESD-30 Code
|
R-PBGA-B100
|
|
JESD-609 Code
|
e1
|
|
Length
|
18 mm
|
|
Memory Density
|
549755813888 bit
|
|
Memory IC Type
|
FLASH
|
|
Memory Width
|
8
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
100
|
|
Number of Words
|
68719476736 words
|
|
Number of Words Code
|
64000000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
64GX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA100,12X17,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Programming Voltage
|
3.3 V
|
|
Seated Height-Max
|
1.4 mm
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
10
|
|
Toggle Bit
|
NO
|
|
Type
|
MLC NAND TYPE
|
|
Width
|
14 mm
|
