Part Details for IDT72V16160L10PFI by Integrated Device Technology Inc
Overview of IDT72V16160L10PFI by Integrated Device Technology Inc
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Part Details for IDT72V16160L10PFI
IDT72V16160L10PFI CAD Models
IDT72V16160L10PFI Part Data Attributes
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IDT72V16160L10PFI
Integrated Device Technology Inc
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Datasheet
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IDT72V16160L10PFI
Integrated Device Technology Inc
FIFO, 8KX16, 6.5ns, Synchronous, CMOS, PQFP80, TQFP-80
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | QFP | |
Package Description | TQFP-80 | |
Pin Count | 80 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 6.5 ns | |
Clock Frequency-Max (fCLK) | 100 MHz | |
Cycle Time | 10 ns | |
JESD-30 Code | S-PQFP-G80 | |
JESD-609 Code | e0 | |
Length | 14 mm | |
Memory Density | 131072 bit | |
Memory IC Type | OTHER FIFO | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 80 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8KX16 | |
Output Enable | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Equivalence Code | QFP80,.64SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 240 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Standby Current-Max | 0.015 A | |
Supply Current-Max | 0.04 mA | |
Supply Voltage-Max (Vsup) | 3.45 V | |
Supply Voltage-Min (Vsup) | 3.15 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn85Pb15) | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 14 mm |