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Overview of IDT72T1885L4-4BBI by Integrated Device Technology Inc
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- Number of FFF Equivalents: ( 0 crosses )
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- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for IDT72T1885L4-4BBI by Integrated Device Technology Inc
Part Data Attributes for IDT72T1885L4-4BBI by Integrated Device Technology Inc
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|---|---|
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Rohs Code
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No
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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INTEGRATED DEVICE TECHNOLOGY INC
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Reach Compliance Code
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not_compliant
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.71
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Access Time-Max
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8 ns
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Alternate Memory Width
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9
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Clock Frequency-Max (fCLK)
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100 MHz
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Cycle Time
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10 ns
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JESD-30 Code
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S-PBGA-B144
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JESD-609 Code
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e0
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Memory Density
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589824 bit
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Memory IC Type
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OTHER FIFO
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Memory Width
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18
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Moisture Sensitivity Level
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3
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Number of Functions
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1
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Number of Terminals
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144
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Number of Words
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32768 words
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Number of Words Code
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32000
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Operating Mode
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SYNCHRONOUS/ASYNCHRONOUS
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Operating Temperature-Max
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85 °C
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Operating Temperature-Min
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-40 °C
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Organization
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32KX18
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Output Enable
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YES
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Equivalence Code
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BGA144,12X12,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Parallel/Serial
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Parallel/Serial
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Peak Reflow Temperature (Cel)
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225
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Qualification Status
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Not Qualified
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Standby Current-Max
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0.05 A
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Supply Current-Max
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0.06 mA
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Supply Voltage-Nom (Vsup)
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2.5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Finish
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TIN LEAD
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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30
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